Technology, Process and Cost
Goodix GSN22 in Honor 500
How Goodix builds a secure, compact NFC + eSE: dual-die teardown, CMOS processes, and end-to-end cost analysis.
SPR26069SCOPE
Analyzed devices: Goodix GSN22
From module/end system : Honor 500
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise measurements
- Package opening
- ASIC delayering
- Material identification
Technology
- NFC controller and Embedded Secure Element
- CMOS (Logic, Analog, SRAM, ROM)
Type of Analysis
- SEM View
- Floorplan
- FIB Cross section
- Delayering
- Optical View
- X-ray View
MANUFACTURING PROCESS FLOW
- Recreation of manufacturing process flow
- Step by step process flow
Technical analysis
- Module​
- Component​
- Process​
- Wafer​
- Material​
- IP
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
REPORT'S OBJECTIVES
- Provide a physical and cost analysis of the Goodix GSN22 integrated NFC + eSE solution.
- Analyze the package construction and multi-die assembly, from external dimensions down to die-level architecture and interconnects.
- Present the manufacturing process and technology for each die at every level (package, die, functional block, metallization stack, process node).
- Provide a reverse-costing breakdown of the component, from finished package down to front-end wafer, and estimate the resulting manufacturer selling price.
Goodix GSN22 is an integrated NFC + eSE solution designed for secure contactless applications in space-constrained electronic devices. By combining an NFC controller and Embedded Secure Element in a single solution, GSN22 addresses the growing demand for secure, compact, and multifunctional connectivity in smartphones, wearables, digital car keys, hardware wallets, public transport, access control, and digital identity applications.
Yole Group’s analysis of the Goodix GSN22 provides insight into the device’s package, die architecture, manufacturing process, cost structure, and estimated selling price. The teardown confirms a compact multi-die implementation and highlights the use of mature CMOS technology, supporting Goodix’s strategy of delivering a secure and integrated NFC solution while controlling manufacturing complexity and cost.
Overview
Company Profile, Supply Chain, Market
Physical Analysis
Manufacturing Process Flow
Cost Analasis
Selling Price Analysis
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