Market and Technology Trends
High-End Performance Packaging 2025
High-End Performance packaging is breaking performance barriers, with chiplet integration enabling the AI revolution. The HEPP market is expected to reach $28.5B by 2030 at a CAGR of 23%.
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Product objectives:
The main objectives of this report are to:
- Identify and describe which technologies can be classified as ‘High-end Performance Packaging’
- Define High-end Performance Packaging
- Analyze key market drivers, benefits, and challenges of High-end Performance Packaging, by application
- Describe the different existing technologies, their trends, and roadmaps
- Consider the supply chain and High-end Performance Packaging landscape
- Update the business status of High-end Performance Packaging technology markets
- Provide a market forecast for the coming years, and estimate future trends
High-end Performance markets are studied from the following angles:
- Top-down, based on end-system demand
- Market valuations based on top-down and bottom-up models
- Market shares, based on production projections
- Supply value-chain analysis
- State-of-the-art technologies and trends
- End-user application adoptions
Key Features
The High-end Packaging market was worth $8B in 2024 and is projected to reach over $28.5B by 2030, with a CAGR2024-2030 of 23%. Breaking it down further into its end markets, the biggest High-end Performance Packaging market is ‘Telecom & Infrastructure,’ with over 67% of the revenue in 2024. It should be followed closely by the ‘Mobile & Consumer’ which is the fastest growing market with 50% CAGR. In terms of package units, High-end Packaging is projected to experience a 44% CAGR2024-2030, from 966M Units in 2024 to 5.34B by 2030. The top fastest-growing platforms are CBA DRAM, 3D SoC, Active Si Interposer, 3D NAND stack & embedded Si bridge.
What's new?
New technology platforms added: CBA DRAM
New technology trend information added: CPO, Glass substrate;
New product and supply chain update;
New assumptions;
Forecast updated
High-end Packaging market will exceed $28B by 2030, with a whopping 23% CAGR2024-2030
The High-end Packaging market was worth $8B in 2024 and is projected to exceed $28B by 2030, with a CAGR2024-2030 of 23%. Breaking it down into its end markets, the biggest High-end Performance Packaging market is ‘Telecom & Infrastructure,’ which generated over 67% of the revenue in 2024. It is followed closely by ‘Mobile & Consumer,’ the fastest-growing market with a 50% CAGR. In terms of package units, High-end Packaging is projected to experience a 33% CAGR2024-2030 from ~1B units in 2024 to +5B units by 2030. This huge growth is explained by the fact that in the case of high-end packages, the demand is increasing healthily, and the ASPs are very high compared to less advanced packaging as there is a transition of value from the front-end to the back-end forced by 2.5D & 3D platforms.3D Stack memory – HBM, 3DS, 3D NAND & CBA DRAM – are the most significant contributors and will represent more than 70% of the market by 2029. The fastest-growing platforms are CBA DRAM, 3D SoC, Active Si Interposer, 3D NAND stack, and embedded Si bridge.
Foundries, IDMs, and top OSATs compete in the same High-end Packaging market space
The barrier to entry in the High-end Packaging supply chain is increasingly high, with major foundries and IDMs disrupting the advanced packaging domain with their FE capabilities. The adoption of hybrid bonding makes things more difficult for OSATs, as only players with fab capabilities and ample resources can afford significant yield losses and large investments.
In 2024 the group of memory players represented by YMTC, Samsung, SK hynix and Micron dominate, with 54% of the high-end packaging market, as 3D stack memory dominates over other platforms in terms of revenue and unit and wafer production. The truth is that much more memory packages are purchased than logic. Individually, TSMC is leading with 35% of market share, followed by YMTC with 20% of the total market. New players like Kioxia, Micron, SK hynix, and Samsung are expected to penetrate the 3D NAND market, rapidly gaining market share. Samsung is number three, with 16%, followed by SK hynix with 13% and Micron with 5%. These players will experience a healthy market share increase as their 3D Stack memories gain more traction and they continue developing new ones. Intel is the next with 6%.
Top OSATs like ASE, SPIL, JCET, Amkor and TF are still there to do the final packaging assembly and test. They are trying to win market share by proposing high-end packaging solutions based on UHD FO and Mold interposer. Another important point is that they are collaborating with top foundries and IDMs to secure their involvement in this type of activity.
The realization of High-end Packaging is now increasingly dependent on FE technology, and hybrid bonding is becoming a new trend. BESI, collaborating with AMAT, is playing a key role in this new trend, supplying equipment to big players such as TSMC, Intel, and Samsung, all of which are competing for supremacy. Other equipment providers like ASMPT and EVG, SET and Suiss MicroTech, Shibaura and TEL are important pieces of the supply chain puzzle.
Semiconductor packaging technology is the key pillar if the future is digital
The main technology trend for all high-end performance packaging platforms, no matter the type, is reducing interconnection pitch – it is related to TSVs, TMVs, microbumps, and even hybrid bonding, which is already the most aggressive solution. In addition, the via diameter and wafer thickness are expected to be reduced. This technology evolution is necessary for integrating more complex monolithic dies, on the one hand, and chiplets, on the other, to support faster data processing and transmission while ensuring less power consumption and loss and allowing higher density integration and bandwidth for future generations.3D SoC hybrid bonding
3D SoC hybrid bonding seems to be a key technology pillar for next-generation advanced packaging, as it allows a smaller interconnection pitch while increasing the total SoC surface. This enables possibilities such as stacking chiplets from partitioned SoC dies, allowing heterogeneous integration packaging. TSMC is the leading player in 3D SoIC packaging using hybrid bonding, thanks to its 3D Fabric. In addition, collective die to wafer is expected to be used starting with a small part of HBM4E with 16-high DRAM stack.
Chiplet and heterogeneous integration is another important trend fueling the adoption of HEP packaging, and products using this approach are already in the market. Examples are Sapphire Rapids using EMIB, Ponte Vecchio using Co-EMIB, and Meteor Lake using Foveros from Intel. AMD is another important player adopting this technological approach in its products, such as Ryzen and EPYC starting with the 3rd generation, along with adopting a 3D Chiplet architecture in MI300. Nvidia finally adopted chiplet design for its next generation Blackwell series. More packages incorporating partitioned or duplicated dies are expected to hit the market in the coming year, as was clearly announced by important players like Intel, AMD, and Nvidia. On top of that, his approach is expected to be used for high-end ADAS in the years to come.
The general trend is to have more 2.5D platforms combined with 3D platforms in the same package which some in the industry are already calling 3.5D packaging. Therefore, we expect packages integrating chiplets using 3D SoC, 2.5D interposers, embedded silicon bridges, and co-packaged optics in the same package in the future. New 2.5D & 3D packaging platforms will hit the market later, making HEP packaging much more complex.
Table of Contents
Introduction
• Table of contents
• Glossary
• 3-Page summary
• Executive summary
• Introduction
◦ Semiconductor Industry
◦ The pursuit of Moore’s Law
◦ AI ASIC for datacenter requires more complex packaging
◦ High-end performance packaging definition
◦ Package family segmentation
◦ High-end performance packaging: all platforms
Market forecasts
• Market forecasts
◦ Package ASP split by technology
◦ Market Size – Revenues
◦ Market Size – Units & Wafers
◦ Market size split by technology:
– 3D SoC
– 3D Stacked memory
– UHD FO / RDL Interposer
– 2.5D Interposers
– Embedded Si bridge
◦ Market Share by top players in 2024
◦ Chapter conclusion
Market trends
• Market trends
◦ Application
◦ Data center
◦ AI and Graphics
◦ CPU
◦ Autonomous vehicles
◦ Chapter conclusion
Technologies Trends
• Technologies Trends
◦ Roadmap
– Key Interconnect technology trend
– By interconnect density and technology node and packaging revenue
– By reticle size
– By front-end vs back-end
– By 2.5D and 3D Technology Trends
– By I/O density, I/O pitch and package size
– By key parameter of Si Interposer, RDL interposer, Si bridge, package level, 3D memory, Hybrid Bond
◦ Overview of High-end Performance Technology Trends
– Topics cover in the report
– Key trend – present and future
– Challenges and requirement
◦ Chiplet and Heterogeneous Integration
– Definition
– Why Chiplet?
– Chiplet introduction by different player for top processor player
– Chiplet Ecosystem
Interposer Trends
• Interposer Trends
◦ Interposer trend overview
◦ Technology offered by companies
◦ Interposer technology comparison
◦ TSMC Interposer comparison
◦ Glass interposer as a new high-end packaging solution
◦ Technical challenge of glass interposer
◦ Different Interposer material comparison
Si Bridge Trends
• Si Bridge Trends
◦ Si bridge trend overview
◦ Technology offered by companies
◦ Technology by Intel and TSMC
◦ Advantages and limitations
Panel Level Package
• Panel Level Package
◦ Why move from WLP to PLP
◦ Comparison of WLP and PLP for large package size
◦ Growing package size
3D Stacking Trends Direct Molecular Bonding
• 3D Stacking Trends Direct Molecular Bonding
◦ 3D interconnect trend overview
◦ Where is hybrid bonding under stacking technologies
◦ Hybrid Bond and Fusion Bond
◦ Hybrid bond timeline for chip maker and equipment maker
◦ Collaboration activities
◦ Advantages and challenges
◦ W2W vs D2W vs collective D2W – process and comparison
◦ Supply chain
CPO
• CPO
◦ Diverse Co-packaging approaches
◦ CPO Time to market
◦ What is CPO?
◦ Heterogeneous integration of EIC and PIC
◦ Interconnect Technology
◦ Type of couplers
◦ Advantages and limitations
◦ Technologies offered by companies
IC Substrate
• IC Substrate
◦ Major requirements for advanced IC substrates
◦ The big challenge for organic substrate and driver for glass core substrate
◦ Key components of glass core substrate
◦ Chapter conclusion – Technology trends
Commercialize Product
• Commercialize Product
◦ Product launched timeline – overall
◦ 3D Memory
◦ GPU
– Nvidia Hopper and Blackwell
– AMD Instinct MI300 series
– Intel Jaguar Shores
◦ AI ASICs
– Intel Gaudi 2 & 3
– Google TPU
– Amazon Trainium & Inferentia
– Microsoft Azure Maia 100
– Huawei Ascend Series
◦ CPU
– AMD Ryzen AI Max Pro 300
– AMD Ryzen & EPYC
– AWS Graviton
– Intel Emerald Rapids & future
– Intel Meteor Lake
– Intel Arrow Lake & Lunar Lake
◦ Conclusion for commercialize product and roadmap by xPU players
Supply Chain
◦ Overview
◦ Mapping of players based on technology: interposer, EMIB, UHD/RDL, Si bridge/mold interposer, 3D stacked memory
◦ HBM supply chain
◦ Global mapping based on HQ
◦ Business model: Who is doing what?
◦ Mapping of players based on technology
◦ Key players: Intel, Samsung and TSMC
◦ China key players
◦ Noteworthy news
◦ Chapter conclusion
Report Conclusion
Yole Group Products
About Yole Group
• About Yole Group
