Technology, Process and Cost
HiSilicon Hi1951 Automotive SoC (Huawei MDC 610)
By Yole SystemPlus —
Full analysis of the powerful HiSilicon Hi1951System-on-Chip embedded in the Huawei MDC610 for Advanced Driver Assistance System and Autonomous Driving cars.
Key Features
- Company profile
- Automotive market analysis
- Detailed photos
- Precise measurements
- Front-end structural analysis with SEM
- Back-end structural analysis with X-ray
- Floorplan
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
What's new
- A newly developed automotive SoC used for ADAS in the Chinese EV market.
- In 2018, Huawei released its MDC series for Audi Q7 to realize urban driving autonomy level four.
- Insight into Huawei’s self-designed advanced SoC for high-level driving autonomy
- Ambarella
- Audi
- Blaize
- Cambricon
- Hailo
- HiSilicon
- Horizon Robotic
- Huawei
- Mobileye
- NVIDIA
- NXP
- Quadric
- Qualcomm
- Renesas
- Samsung
- SemiDrive
- Siengine Technology
- ST
- Indie
- Infineon
- Intel
- TESLA
- TI
- TOSHIBA
- TSMC
- XILINX
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Profile
- Huawei MDC Series
- Market Analysis
Physical Analysis
- Summary
- Analysis Methodology
- Packaging Assembly
- SoC Die
Manufacturing Process Flow Analysis
- Wafer Front-End Fabrication Unit
- SoC Die Process
- Back-End 0
- Assembly Unit
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Reports
About Yole Group
The number of sensors in cars is growing. So too is the need for Advanced Driver Assistance Systems (ADAS) and autonomy functions. Together, these trends are pushing car architectures toward more centralization, which requires an ADAS domain controller with a powerful System-on-Chip (SoC). By 2027 we estimate that around 5% of cars shipped will have this centralized architecture.
This full reverse costing study has been conducted to provide insights into technology data, manufacturing cost and selling price of the HiSilicon Hi1951 SoC embedded in the Huawei MDC 610.
Several car manufacturers are now using advanced SoCs in their models. This encourages chip designers to develop powerful automotive processors manufactured with state-of-art lithographic technology nodes. The ambitious Chinese enterprise, Huawei, participates in this battle. In 2018, Huawei released its MDC series for the Audi Q7 to realize urban driving autonomy level four (L4). The MDC series is an intelligent driving computing platform, working as the mind of the car. It enables the vehicle to handle several scenarios of city driving. This platform is equipped with Huawei’s self-designed Central Processing Units (CPUs) and Artificial Intelligence (AI) processors. Huawei reported that the MDC 300F is powered by HiSilicon Kunpeng 920s CPUs plus two Ascend 310 AI processors. However, inside the MDC 610, we found the SoC fits neither the size of Kunpeng nor Ascend. But still, the SoC die is manufactured with TSMC’s 7nm FinFET lithographic process, same as the HiSilicon Kunpeng 920s.
In 2021, Huawei officially released the MDC 610, after it had already passed the ISO26262:2018 ASIL D standard certified by TÜS SÜD to ensure its functional safety. This computing platform is said to deliver over 200 TeraOperations Per Second (TOPS) and could support up to L4 driving autonomy. In this report, we analyze the HiSilicon Hi1951 SoC which is embedded in the MDC 610 platform.
To reveal the details of the HiSilicon Hi1951 SoC, this report features multiple analyses. One is a front-end construction analysis to reveal the key features of the TSMC 7nm process. Another is a back-end construction analysis for the packaging structure. Also, this report includes a detailed study of the SoC die and its cross-sections. In addition, this report includes a complete analysis by using Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) cross-sections, material analyses, and delayering. It uses X-ray photos of whole chips give general views of SoC die packages. The floorplan of the SoC die is also presented in order to provide a clear view of IP blocks. Lastly, this report furnishes a complete cost analysis and a selling price estimation of the HiSilicon Hi1951 SoC.
