Technology, Process and Cost

Horizon Robotics Journey 6E Automotive ADAS SoC

Aug 2025

Detailed physical data, data processing unit architecture analysis and cost structure of Horizon Robotics’ latest generation of ADAS SoC

SPR25971

Key Features

Latest Horizon Robotics automotive ADAS SoC
Detailed optical and SEM photos
Precise measurements
Die analysis
Package analysis
CoWoS manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Physical Comparisons
Floorplan

Report's Objectives

Provide technology data, manufacturing cost and selling price.
Teardown details on Horizon Robotics Journey 6E SiP module to reveal the components supporting the main processor on the module board
Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
Clear view on the technology and supply chain.
SoC package size, die size, die delayering to reveal the manufacturing
SoC floorplan to reveal the IP architecture.
Automotive SoC manufacturing, its supply chain and cost structures.

This full reverse costing study provides insights regarding the technology data, manufacturing cost, and selling price of the Horizon Robotics Journey 6EAutomotive ADAS SoC.

The rapid rise of China’s ADAS (Advanced Driver-Assistance Systems) ecosystem marks a new era in global automotive market, with domestic semiconductor players aggressively expanding their capabilities. At the heart of this momentum lies an accelerating focus on processor development, as Chinese companies seek to reduce dependence on foreign suppliers and tailor compute architectures for local market needs.

One of the most prominent examples is Horizon Robotics, whose latest Journey 6 series illustrates China’s advancing capabilities in developing high-performance, AI-driven automotive SoCs. The Journey 6 family includes six distinct chip models, each targeting different levels of autonomous driving. In this report, we focus specifically on the Journey 6E, a leading variant in the series, designed for L2+ to L4 autonomous driving applications. The Journey 6E features a custom-designed SiP module built on advanced FinFET technology.

This report provides an in-depth teardown and analysis of the Journey 6E SoC, including high-resolution optical microscopy (OM) and scanning electron microscopy (SEM) imaging of both the chip packaging and die features. These analyses reveal critical insights into the chip’s integration, architecture, and manufacturing techniques. In addition, we identify the manufacturing process node and foundry-level characteristics, which serve as the foundation for a detailed cost analysis. This includes a full breakdown of the bill of materials (BOM) and associated manufacturing costs, enabling a clear evaluation of the Journey 6E’s economic positioning and competitiveness within the automotive ADAS market.

In its second edition, the report is further enhanced with a detailed die floorplan analysis, highlighting key functional blocks such as CPU clusters, Brain Processing Units (BPUs), memory subsystems, interface controllers, and security elements. This analysis provides deeper insights into Horizon Robotics’ architectural choices and system-level integration strategies.