Huawei 5G AAU5613 Early Generation Chipset

• Huawei
• HiSilicon
• Analog Devices
• Qorvo
• Sumitomo

Key Features

• Overview teardown of the system
• Detailed optical and scanning electron microscope images
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis

What's new

• Overview teardown of the Huawei 5G AAU early generation base station chipset
• Detailed technical and cost analysis of selected devices
• Analysis of the Huawei 5G AAU early generation AAU5613 chipsets, antenna elements, filters, PCBs, and designs

Huawei is one of the five leading base station manufacturers. Yole Intelligence assumes that most fifth generation (5G) deployments will be sub-6GHz by the end of 2023. Of these almost 45% will be massive multiple input multiple output (mMIMO) active antenna systems (AASs).

For 5G mMIMO and 5G new radio (NR), and targeting the sub-6GHz frequencies, 5G NR band n78, Huawei introduced its 5G active antenna unit (AAU). The AAU is a 64-transceiver (TR) chain system. In traditional base stations, passive antennas are connected to the remote radio head (RRH) systems via radio frequency (RF) cables, creating two different units, namely the RRH and the antennas. AASs integrate the antennas and the TR chains in one single unit. The AASs are very compact and therefore they save and optimize space. No extra physical space is needed on already-established network sites, which reduces site footprint. AASs are also more energy efficient, with lower cable losses compared to traditional systems. Moreover, AASs cut installation time and costs and are also scalable.

The Huawei 5G AAU is designed for outdoor installations and intended for pole, wall, tower, or mast mounting. The AAU has four main printed circuit boards (PCBs) with many different components. We have selected the major components from three different PCBs to analyze them.

This report includes an investigation of the system, both detailed and overview technical studies of the major components from HiSilicon, the SD6603, SD6185, and SD6219E, Analog Devices, the AD80408, Sumitomo, the KHE26T0 and KHE22S, and Qorvo’s QPB9319. It includes die analyses and cross-sections and manufacturing process estimations. The report provides thorough energy-dispersive X-ray (EDX) analyses of the antenna element, filter, and the PCBs. Based on the physical analyses performed, assumptions on the Huawei 5G AAU system’s functionality are made, and the corresponding block diagrams are provided. This report also contains cost analyses of the identified main components of the Huawei 5G AAU.

Overview / Introduction                                                                                           

• Executive Summary
• Reverse Costing Methodology
• Glossary

Company Profile

• Huawei
• HiSilicon
• Analog Devices
• Qorvo

Physical Analysis                                                                                                         

• Analysis procedures
• Central Processing Unit PCB
  • SD6603
    • Package Views & Dimensions
    • Package Opening
    • Die Views And Dimensions
    • Die Delayering
  • SD6185
    • Package Views & Dimensions
    • Package Opening
    • Die Views And Dimensions
    • Die Delayering
• RF Main Board                                                                              
  • SD6219E
    • Package Views & Dimensions
    • Package Opening
    • Die Views And Dimensions
    • Die Delayering
  • AD80408
    • Package Views & Dimensions
    • Package Opening
    • Die Views And Dimensions
    • Die Delayering
  • KHE26T0
    • Package Views & Dimensions
    • Package Opening
    • Die Views And Dimensions
  • KHE22S
    • Light technical analysis
  • QPB9319
    • Light technical analysis
  • Antenna PCB
    • Antenna element and Filter dimensions
    • EDX analysis of antenna element
    • EDX analysis of the Filter
    • EDX analysis of the PCBs

Manufacturing Process                                                                                          

• Global Overview
• SD6603
• SD6185
• SD6219E
• AD80408
• KHE26T0
  • Supply chain
  • Manufacturing Unit

Cost Analysis                                                                                                              

• SD6603
• SD6185
• SD6219E
• AD80408
• KHE26T0
  • Wafer front end cost analysis
  • Die Cost
  • Package Cost
  • Component Cost & Price

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