Technology, Process and Cost

Huawei/Hisilicon 800G CWDM Silicon Photonic PIC

Jun 2026

Analysis of the silicon photonic die in the Huawei/Hisilicon 800G CWDM optical transceiver, which features a demultiplexer and the photodiodes on a silicon photonic die.

SPR26052

SCOPE

Analyzed devices
Huawei/Hisilicon SiPho die

From module/end system

Huawei/Hisilicon OM3877FX200
CWDM 800G optical transceiver

PHYSICAL ANALYSIS

Detailed optical & SEM imaging, thickness measurements, package opening, material identification, and light-path analysis, all in one comprehensive teardown report.

Technology

Tower Semiconductor silicon photonic
Huawei/Hisilicon SiPho die

Type of Analysis

SEM View
Flooprlan
Cross section
Optical View
Infrared View

MANUFACTURING PROCESS FLOW

Recreation of manufacturing process flow

Technical analysis

Module disassembly
Component
Process
Wafer
Material
IP
Packaging

COST ANALYSIS

Understand the supply chain landscape and optimize your strategy with in-depth device cost simulation.

Type of Analysis

Die cost
Yields
Package assemble cost
Raw wafer cost
Wafer Front-End cost
Die cost
Dicing & Probe test cost
Package assemble cost
Final test cost

Report's objectives

Analyze the silicon photonic die and its integration in the optical transceiver.
Present main functions and technological solutions used in the SiPho die, (waveguide, edge-coupler, demultiplexer, photodiode).

The datacenter optical transceiver market is experiencing strong growth with a CAGR estimated at 15% by Yole Group (, driven by the rapid expansion of AI workloads, cloud computing, and high-performance networking infrastructure (Optical Transceivers for Datacom and Telecom 2026). As hyperscale datacenters demand higher bandwidth and lower latency, the industry is accelerating the transition from 400G to 800G optical transceivers. This shift enables significantly higher data throughput while improving power efficiency and reducing cost per transmitted bit. The adoption of 800G solutions is expected to become a major growth engine over the next few years, particularly in AI clusters and next-generation Ethernet architectures.

This reverse costing study has been conducted to provide insight on the technology data, manufacturing cost, and selling price of the Silicon Photonic component found in the Huawei/Hisilicon 800G CWDM Optical Transceiver.

You can find the mechanical and electronic assembly analysis and costing in our Teardown Track : Huawei OM3877FX200 800G Optical Transceiver Module.

Huawei/Hisilicon 800G CWDM allows to communicate up to 2km in Pulse-Amplitude Modulation 4-level (PAM4). The Huawei/Hisilicon solution is based on a silicon photonic die for the receiver with the demultiplexer and the photodiodes on the same die.

This report delivers a comprehensive analysis of the Huawei/Hisilicon 800G Coarse Wavelength Division Multiplexing (CWDM) optical transceiver. It includes an in-depth investigation of key internal functions, such as the waveguide, edge-coupler, couplers and the photodiodes. The study also includes a detailed cost breakdown and pricing estimation.

A complete physical teardown was performed, incorporating scanning electron microscopy (SEM), cross-sectional imaging, and energy-dispersive X-ray spectroscopy (EDX) to identify materials and unveil the technical specifications of the transceiver’s critical elements.

The report provides valuable insights into Huawei/Hisilicon’s design and technology choices for this silicon photonic die.

Additional subsystems including electronic, optical, and mechanical housing components are also analyzed in the report SPTT26004. The study further details the optical interface and assembly workflows. Finally, a comprehensive cost estimation for the assembly of both optical and electronic modules is presented.

Do you have an account?

Search

Huawei/Hisilicon 800G CWDM Silicon Photonic PIC

Analysis of the silicon photonic die in the Huawei/Hisilicon 800G CWDM optical transceiver, which features a demultiplexer and the photodiodes on a silicon photonic die.