Technology, Process and Cost
II-VI/Finisar 100Gb CWDM4 Optical Transceiver
By Yole SystemPlus —
Deep analysis of FTLC1157RGPL-TE, the 100Gb CWDM4 optical transceiver from the US leading supplier.
SPR21615
This full reverse costing study has been conducted to provide technology data, manufacturing cost and the selling price of the Finisar’s FTLC1157RGPL-TE 100Gb CWDM4 transceiver. Finisar’s 100G CWDM4 100G optical transceiver allows communication up to 2km. The Finisar solution is based on the Maxim MAX24025IMP and the Semtech GN2110.
The transceivers come with two separated lines, each with several dies. The transmitter integrates four InP lasers driven by the Maxim dies. Other components are added to the system in order to focus or isolate the signals. It uses InP Distributed FeedBack (DFB) lasers. The multiplexer is based on several narrow bandpass filters to create the spatial multiplexer. The connector assembly is complex, with all the optical parts of the multiplexer.
The receiver function is performed by InP photodiode die, a TransImpedance Amplifier (TIA) and Clock and Data Recover (CDR) function circuit. A fiber optical coupler and Arrayed Waveguide Grating (AWG) demultiplexer are used to connect the photodiode die with the fiber optic.
This report contains an exhaustive analysis of the Finisar’s 100G CWDM4 optical transceiver. It includes a full analysis of the laser dies, photodiode dies, the TIA-CDR circuit, a cost analysis and price estimate. Scanning Electron Microscope (SEM) pictures, cross-sections, Energy Dispersive X-ray (EDX analysis) have been used to to identify the different materials used in manufacturing and to to show all the technical characteristics of the main component of the optical transceiver. The report presents details also on the optical parts and the assembly line. Finally the report presents a calculation of the cost of assembly of the electronic and the optical parts and an estimation of selling price.
Complete teardown with:
- Explanation of device operation
- Detailed optical and SEM photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated sales price
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile
- Finisar II-IV
Market Analysis
- Ecosystem and Forecast
Physical Analysis
- II-VI 100G CWDM4 Teardown
- Module Views
- Function Identification
- Transmitter Block
- View, Dimensions and Cross-Section
- Fiber Optic Coupler, Prism and Rotator
- Light Way and Lens
- Maxim MAX24025IMP Die
- II-VI Finisar Photodiode Die
- Die Overview, Dimensions, Process and Cross-Section
- II-VI Finisar InP Laser
- InP Waveguide
- InP Electro-Absorption Modulator
- Laser Process and Cross-Section
- Receiver Block
- Fiber Optic Coupler
- Light Way
- AWG
- II-VI Finisar InP Photodiode Die
- Semtech GN2110 TIA Die
Manufacturing Process
- Optical Elements
- Maxim Die Fab Unit
- InP Photodiode Emitter Flow and Unit
- InP Laser Flow and Unit
- InP Diode Flow and Unit
- TIA Die Fabrication Unit
- Transceiver Assembly Unit
Cost Analysis
- Summary of the Cost Analysis
- Yield Explanations and Hypotheses
- Transmitter Block
- Maxim MAX24025IMP
- Finisar Emitter Photodiode Die
- Finisar InP Laser Die
- Optical Elements
- Receiver Block
- Finisar InP Photodiode Die
- Semtech TIA and CDR Die
- Optical Element
- Transceiver Assembly Cost
- Optical Transceiver Cost
- Optical tranceiver selling price
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