Technology, Process and Cost
Infineon - IRS20957STRPBF
Detailed physical data, high-voltage Class-D audio driver architecture and process-flow analysis, and cost structure assessment of the Infineon IRS20957STRPBF, originally developed by International Rectifier.
SPR26049Analyzed devices
- Infineon IRS20957STRPBF
Technology
- BCD 600 nm
- Class-D Audio Amplifier Driver
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
Type of Analysis
- SEM View
- Cross section
- Delayering
- Optical View
- X-ray View
- Recreation of manufacturing process flow
Technical analysis
- Component
- Process
- Wafer
- Material
- Packaging
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
Report objectives:
- Describe the physical structure of the Infineon IRS20957STRPBF, including its package, die, dimensions, materials, and assembly.
- Identify its functional architecture and main Class-D audio-driver building blocks.
- Estimate the component’s manufacturing cost, including wafer fabrication, die cost, packaging, assembly, and testing.
In recent years, Class-D audio amplifiers have become key components in high-power audio systems, offering high efficiency, compact designs, and reduced thermal losses.
This report presents a detailed physical, technical, manufacturing, supply-chain, and costing analysis of the IRS20957STRPBF high-voltage Class-D audio driver. Originally developed by International Rectifier, the device became part of Infineon’s portfolio following the acquisition of International Rectifier in 2015.
We provide a complete analysis of the component’s architecture, semiconductor process, package assembly, manufacturing flow, and estimated production cost.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Package
- Overview & Dimensions
- Xray
- Package Opening
- Cross-section
- IC Die
- Die Overview & Dimensions
- Die Delayering
- Die Cross-section
- Summary
Manufacturing Process Flow
- Overview
- IC Die Process Flow
Cost Analysis
- Synthesis
- Front-End Cost
- Die Cost
- Packaging Cost
- Component Cost
Selling Price Analysis
- Definitions of Price
- Manufacturer Financials
- Component Price
Infineon