Technology, Process and Cost
Infineon - MA5342MS 2x200W Class D Amplifier Merus Audio
Detailed physical data, integrated high-voltage Class-D audio amplifier architecture and process-flow analysis, and cost structure assessment of the Infineon MA5342MSXUMA1.
SPR26050Analyzed devices
- Infineon MA5342MSXUMA1
Technology
- BCD 500 nm
- Class-D Audio Power Amplifier
Physical Analysis
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
Type of Analysis
- SEM View
- Cross section
- Delayering
- Optical View
- X-ray View
Manufacturing Process Flow
- Recreation of manufacturing process flow
Technical analysis
- Component
- Process
- Wafer
- Material
- Packaging
Cost Analysis
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
Report objectives:
- Describe the physical structure of the Infineon MA5342MSXUMA1, including its multichip package, dies, dimensions, materials, interconnections, and assembly.
- Identify its functional architecture and main integrated Class-D audio-amplifier building blocks, including the controller, high-voltage gate drivers, protection functions, and power MOSFETs.
- Estimate the component’s manufacturing cost, including wafer fabrication for each die, die cost, multichip packaging, assembly, interconnection, and testing.
In recent years, integrated Class-D audio amplifiers have become key components in high-power audio systems, combining high efficiency, compact form factors, and reduced thermal losses.
This report presents a detailed physical, technical, manufacturing, supply-chain, and costing analysis of Infineon’s MA5342MSXUMA1, a MERUS™ multichip audio amplifier integrating the controller, high-voltage gate drivers, and power MOSFETs in a single package.
We provide a complete analysis of the device architecture, semiconductor technologies, package assembly, manufacturing flow, and estimated production cost.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Package
- Overview & Dimensions
- Xray
- Package Opening
- Cross-section
- IC Die 1
- Die 1 Overview & Dimensions
- Die 1 Delayering
- Die 1 Cross-section
- Summary
- MOSFET Die 2
- Die 2 Overview & Dimensions
- Die 2 Delayering
- Die 2 Cross-section
- Summary
Manufacturing Process Flow
- Overview
- IC Die 1 Process Flow
- MOSFET Die 2 Process Flow
Cost Analysis
- Synthesis
- Front-End Cost
- Die Cost
- Packaging Cost
- Component Cost
Selling Price Analysis
- Definitions of Price
- Manufacturer Financials
- Component Price
Infineon