Technology, Process and Cost
Infineon OPTIGA TPM SLI 9670
By Yole SystemPlus —
Microcontroller providing security to complex automotive systems for enhanced automotive safety
SPR23650
Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Profile
- Infineon
- Market Analysis
Physical Analysis
- Board Teardown
- Packaging Analysis (dimensions, X-Ray, cross section, opening)
- IC Die Analysis (dimensions, cross section, delayering, process)
Manufacturing Process Flow
- Global Overview
- IC Die Front-End Process
- IC Die Front-End Wafer Fabrication Unit
- Final Test and Packaging Process
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- IC Die Front-End Wafer Cost
- IC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
What's new
- Trusted security Integrated Circuit
With increasing number of electrification and autonomous driving, modern cars require advanced safety and enhanced security features. Common security threats to modern cars can involve hacking, attacks, and disablement of safety features. As connectivity in cars is growing and security becomes a major concern, establishing security within the car and other external communication is fundamental. To enhance the safety and security in automobile vehicles Infineon announced the world’s first trusted Platform module for cybersecurity in connected cars. The TPM module uses a high-end security microcontroller with advanced algorithms implemented in hardware.
Infineon Optiga TPM SLI 9670 IC part of the OPTIGA™ TPM family offering a rich feature set of security functions. It is Designed to support demanding automotive security security to complex automotive systems and supports automotive safety. It addresses security concerns that include personal user data, security certificates, embedded code and embedded data in automobile vehicles. The microcontroller has a huge range of potential applications that include car sharing, remote car access and fleet management. It uses highly reliable nonvolatile memory on the circuit. Its system is simplified and cost efficient.
To reveal all the details of the Infineon Optiga TPM SLI 9670 IC, this report features several analyses. It includes the front-end construction analysis to reveal the key features on the integrated circuit and the patterning technology used in the process. The back-end construction analysis is gives detail on the packaging structure. The report includes a detailed study of the IC die and both cross sections of the package and die. The Optical images are complimented by SEM images and EDX analysis to determine various material used in the manufacturing process of the IC Component. Lastly, this report furnishes a complete cost analysis and a selling price estimation of the Infineon Optiga integrated circuit.
- Infineon