Technology, Process and Cost

Innolight T-OL8CNT-N00 800G CWDM Silicon Photonic Die

Jul 2026

Detailed physical data, data processing unit architecture analysis, and cost structure of Innolight’s latest-generation Silicon Photonic die.

SPR26057

This report examines the silicon photonic components of the Innolight 800G CWDM optical transceiver, an 800G module designed for datacenter with transmission distances up to 2 km. It highlights the silicon photonic die, the core of the system, which integrates 8 MZI modulators, several multiplexers, photodiodes and versatile splitter-combiner waveguides.

What you'll find in this report?

Physical analysis	Manufacturing Process Flow analysis	Cost Analysis
SEM View Floorplan Cross section Delayering Infrared View Optical View	Module Component Process Wafer Material IP Packaging	Supply chain evaluation Simulation of device cost Die cost Yields Raw wafer cost Wafer Front-End cost Die cost Dicing & Probe test cost Final test cost

Report objectives:

Analyze the silicon photonic die and its integration in the optical transceiver’s transmitter function.

Present main functions and technological solutions used in the SiPho die (waveguide, edge-coupler, multiplexer, photodiode, MZI modulator, thermo-optic modulator).

The datacenter optical transceiver market is experiencing strong growth with a CAGR estimated at 15% by Yole Group, driven by the rapid expansion of AI workloads, cloud computing, and high-performance networking infrastructure (Optical Transceivers for Datacom and Telecom 2026). As hyperscale datacenters demand higher bandwidth and lower latency, the industry is accelerating the transition from 400G to 800G optical transceivers. This shift enables significantly higher data throughput while improving power efficiency and reducing cost per transmitted bit. The adoption of 800G solutions is expected to become a major growth engine over the next few years, particularly in AI clusters and next-generation Ethernet architectures.

This reverse costing study has been conducted to provide insight on the technology data, manufacturing cost, and selling price of the Silicon Photonic component found in our Teardown Track : Innolight T-OL8CNT-N00 - 800G Optical Transceiver Module.

Innolight 800G CWDM allows to communicate up to 2km in Pulse-Amplitude Modulation 4-level (PAM4). The Innolight solution is based on a silicon photonic die for the receiver with the demultiplexer and the photodiodes on the same die.

This report delivers a comprehensive analysis of the Innolight 800G Coarse Wavelength Division Multiplexing (CWDM) optical transceiver. It includes an in-depth investigation of key internal functions, such as the waveguide, edge-coupler, splitter/combiner, the MZI modulators, multiplexers and the germanium photodiodes. The study also includes a detailed cost breakdown and pricing estimation.

A complete physical teardown was performed, incorporating scanning electron microscopy (SEM), cross-sectional imaging, and energy-dispersive X-ray spectroscopy (EDX) to identify materials and unveil the technical specifications of the transceiver's critical elements.

The report provides valuable insights into Innolight design and technology choices for this silicon photonic die.

Additional subsystems including electronic, optical, and mechanical housing components are also analyzed in this related Teardown Tracks. The study further details the optical interface and assembly workflows. Finally, a comprehensive cost estimation for the assembly of both optical and electronic modules is presented.