Technology, Process and Cost

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

By Yole SystemPlus

First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory


  • Detailed photos and cross-sections
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Physical comparison with NVIDIA Tesla and TSMC CoWoS, and AMD Radeon Vega and SPIL CoW

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