Technology, Process and Cost Comparison

Internet of Things Modules Comparison 2026

May 2026

From LTE Cat 1 bis to 5G RedCap: a teardown-driven comparison of SIMCom, Semtech, and Quectel IoT modules and their cost structures.

SPR26019

SCOPE

Analyzed devices

SIMCom A7683E
ASR1606
XinpleTek 573311
Semtech HL7900
Sony ALT1350
Qorvo FJC7
Quectel RG255AA
ASR1903
XMC 25QU128C
Xinpletek 512911
Xinpletek 5643-82

PHYSICAL ANALYSIS

Detailed photos in optical and SEM views
Precise thickness measurements
Package opening
ASIC delayering & Cross-section
Material identification

Technology

LTE Cat 1 bis & 4G LTE
5G RedCap
IoT cellular modules
CMOS & MOSFET
SiGe BiCMOS
MIM capacitors
High-K Metal Gate

Type of Analysis

SEM View
Floorplan
Cross section
IR View
Delayering
Optical View
X-ray View

MANUFACTURING PROCESS FLOW

Recreation of manufacturing process flow

Technical analysis

Module
Component
Process
Wafer
Material
Packaging

COST ANALYSIS

Supply chain evaluation
Simulation of device cost

Type of Analysis

Die cost
Yields
Package assemble cost
Raw wafer cost
Wafer Front-End cost
Die cost
Dicing & Probe test cost
Package assemble cost
Final test cost

WHAT'S NEW

The 2024 report compared four IoT, LTE-M, and NB-IoT modules at the chipset, technology, process, and cost levels. The new report expands the technology scope, covering solutions ranging from low-cost LTE Cat 1 bis to LPWA/NTN and 5G RedCap.

This report also provides more detailed coverage of RF front-end architectures and filtering components.

The 2026 report introduces a largely new silicon ecosystem, including:

ASR1606 for the SIMCom A7683E
Sony ALT1350 for the Semtech HL7900
ASR1903 for the Quectel RG255AA-CN
XMC 25QU128C
ASR PM802S
XinpleTek 573311, 512911, and 5643-82
Additional Chinese suppliers for RF front-end components, switches, LNAs, PMUs, and filters

This shifts the benchmark toward ASR and Chinese supply-chain components, whereas the 2024 report was more focused on Altair, Sequans, Qualcomm, Qorvo, Skyworks, Murata, and Telit Cinterion.

REPORT'S OBJECTIVES

Compare IoT module integration strategies across LTE Cat 1 bis, LPWA/NTN, and 5G RedCap
Analyze internal architectures, silicon content, and RF front-end designs
Perform detailed physical, process, and package analysis
Reconstruct manufacturing and assembly processes
Benchmark module costs, BOM structures, and selling prices
Identify the main cost and integration drivers across technologies

This report compares three IoT cellular modules that represent different integration strategies and market price points: the SIMCom A7683E, Semtech HL7900, and Quectel RG255AA-CN. The study combines teardown, physical analysis, process reconstruction, reverse costing, and selling-price estimation to benchmark architecture, silicon content, packaging complexity, and commercial positioning. Overall, it shows that module cost is increasingly driven by SoC integration, RF front-end complexity, and PCB/package size, rather than passive components alone.

The SIMCom A7683E is a compact LTE Cat 1 bis LGA module designed for Europe-focused LTE-FDD deployments. It supports bands B1/B3/B5/B7/B8/B20/B28, operates from -40 to +85 °C, measures 15.7 × 17.6 × 2.4 mm, and delivers up to 10 Mbps downlink and 5 Mbps uplink. It is based on the ASR1606, a highly integrated 4G LTE Cat 1 bis IoT chipset targeting low-cost applications such as POS, tracking, metering, and telematics.

The Semtech HL7900 is a global LPWA module for Cat-M1, Cat-NB2, and optional NTN applications. Semtech emphasizes battery life, coverage, longevity, and security, with claimed current consumption up to 80% lower than the previous HL78 generation and support for 3GPP Releases 14, 15, 16, and 17. The module also integrates GNSS, a low-power MCU, and optional secondary radio features for hybrid connectivity. It uses the Sony ALT1350, an ultra-low-power LTE-M/NB-IoT chipset designed for battery-powered LPWA IoT, with the added advantage of combining terrestrial LPWA and NTN satellite connectivity in one solution.

The Quectel RG255AA-CN is the most advanced of the three in radio capability. Quectel markets the RG255AA series as 3GPP Rel-17 5G RedCap modules supporting 5G SA and LTE Cat 4, with theoretical speeds of 226 Mbps downlink and 120 Mbps uplink. The series also includes features such as 5G LAN, URLLC, and network slicing. Public information indicates both RG255AA-CN and RG255AA-EU variants, with the CN version tailored for China-band coverage. The module is based on the ASR1903, a 5G RedCap chipset for industrial IoT, supporting Rel-17 NR SA and LTE Cat 4 dual-mode operation for mid-tier 5G devices needing higher performance than LPWA or Cat 1.

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Internet of Things Modules Comparison 2026

From LTE Cat 1 bis to 5G RedCap: a teardown-driven comparison of SIMCom, Semtech, and Quectel IoT modules and their cost structures.