Technology, Process and Cost
IRay Technology 12µm and 17µm Thermal Sensors
By Yole SystemPlus —
Comparison between 12µm and first and second generation 17µm LWIR microbolometers from Chinese manufacturer IRay Technology’s.
Founded in 2009, Yantai iRay Technology Co., Ltd. is now a leader of infrared technology in China and the world. During the last six years, IRay Technology has upgraded its technologies from 17µm to 12µm processes. This report highlights the quick evolution of microbolometer technology in China.
IRay Technology has a broad range of products from thermal camera plug-ins for smartphones to Focal Plane Array (FPA) detectors, cores and thermal cameras for military applications. IRay Technology already has a camera for today’s high growth market, health security, and tomorrow’s high growth market, automotive and Advanced Driver Assistance Systems (ADAS). All the products integrate the Raytron Technology microbolometer dies. Today, the 17µm and 12µm node microbolometers are the most widely used sensors in iRay products.
This full reverse costing study has been conducted to provide insight into technology data, the manufacturing cost and selling price of three IRay Technology/Raytron Technology microbolometers. These include the RTD611 and RTD3172, two different generations of 17µm microbolometers, and the RTD6122, a 12µm microbolometer.
Metallic and ceramic package technologies are studied in this report followed by the choice of material for the windows and the filters.
The three microbolometers use all Vanadium Oxide (VOx) technology. The newest generation in 17µm technology and the 12µm dies have an umbrella structure above the VOx that increases the sensitivity of the components.
With a definition between 640×512 and 384×288 pixels the three microbolometers are designed for large markets, including consumer, industrial, automotive and security.
Along with the complete technical analysis of the three microbolometer components, this report analyses their cost and estimates their price. Finally it includes a technical and cost comparison between the three microbolometers.
Overview/Introduction
Company Profile and Market Analysis
Physical Analysis
- Summary of the Physical Analysis
- 17 µm Microbolometer, First Generation
- Package views
- Die overview and dimensions, process, cross-section and process characteristics
- 17µm Microbolometer, Second Generation
- Package views and cross-section
- Die overview and dimensions, process, cross-section and process characteristics
- 12µm Microbolometer
- Package views and cross-section
- Die overview and dimensions, process, cross-section and process characteristics
Manufacturing Process Flow
- RTD611
- Overview
- ROIC Wafer
- Microbolometer Wafer
- Process Flow
- RTD3172
- RTD6122
Cost Analysis
- Yield Explanations and Hypotheses
- RTD611
- ROIC Front-end cost
- Microbolometer wafer and die cost
- IR window cost
- Package cost
- Component cost
- RTD3172
- RTD6122
Price Estimation
Technical and Cost Comparison
Reverse costing with:
- Analysis of the three microbolometer components, including microbolometer die, package and window
- Detailed optical and SEM photos
- Precise measurements
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology comparisons between the three technologies, 12µm, 17µm with umbrella and 17µm
