Technology, Process and Cost
MCU - Nuvoton M2L31 512 KB RRAM
Full reverse costing analysis of Nuvoton M2L31 MCU, detailing packaging, IC die, IP blocks, and embedded ReRAM technology for industrial applications.
SPR24890
Key Features:
- Detailed photos
- Precise measurements
- Packaging structural analysis with X-ray & optical analysis
- EDX Analysis of ReRAM
- TEM Picture of RERAM
- Materials analysis
- Front-end structural analysis with scanning electron microscopy
- Manufacturing process flow
- Manufacturing and supply chain cost analysis
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Nuvoton M2L31 MCU.
The manufacturing process utilizes TSMC's advanced ReRAM technology node.
The NuMicro® M2L31 series is based on Arm Cortex-M23 core at Armv8-M architecture. It runs up to 72 MHz and features 64 to 512 Kbytes ReRAM, 40 to 168 Kbytes SRAM, 1.71V to 3.6V operating voltage, -40°C to 105°C wide operating temperature, a variety of packages choices, and excellent high immunity characteristics by 4 KV ESD HBM and 4.4 KV EFT. The M2L31 series supports Execute-Only Memory function to protect confidential program code information from being stolen in the run-time.
- Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
- Company Profile
- Nuvoton
- Physical Analysis
- Summary of the physical analysis
- Board Disassembly
- Packaging
- IC Die
- Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
- Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Wafer Back-end 0 Cost
- IC Die Cost
- Packaging Cost
- Component Cost
- Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
- Feedbacks
- Related Report
- About Yole Group
TSMC, Nuvoton