MediaTek Dimensity 9200 SoC

In a smartphone processor market that earned $10.4B for APU designers in Q3-2022, the Dimensity 9200 contributes to MediaTek's high-end APU offering while integrating the most advanced foundry node available.

This full reverse costing study was conducted to provide insight into the technology data, manufacturing cost, and selling price of the MediaTek Dimensity 9200 system-on-chip (SoC).

MediaTek launched its Dimensity SoC series as an ultra-efficient chip for 5G smartphone in 2020. In 2022, the newest generation Dimensity 9200 was released as the company’s flagship for mobile computing. The SoC die is fabricated by using the world’s most advanced TSMC second-generation 4nm technology and equipped with a whole new architecture to boost its performance and optimize its power consumption.

An octa-core CPU architecture, including the exclusive Arm Cotex-X3, three Arm Cortex-A710s, and four Arm Cortex-A510s, is used to achieve the best energy efficiency and task operation. The memory supports up to 8533 Mbps, which adds 13% bandwidth compared to its predecessor. The die also comes with an 8-channel UFS 4.0 to upgrade its storage capacity. Moreover, to bring the graphic experience to another level, the SoC die contains an 11-core Arm Immortalis-G715. The die is also integrated with MediaTek’s 6^th-generation APU 690 to level-up the AI performance. The chip uses the ISP 890 – the first ISP-native RGBW sensor support to improve the photo resolution. Furthermore, MediaTek introduces the first Wi-Fi 7 for a smartphone processor, which is realized in the Dimensity 9200.

The MediaTek Dimensity 9200 SoC contains SRAM caches in the die and includes an external LPDDR5X DRAM with packaging. The advanced ball-grid-array packaging technology is used for integrating the SoC die with upper and bottom substrate. Then the DRAM package is stacked on the SoC die package with PoP (package-on-package) technology.

To reveal all the details of the Dimensity 9200 SoC, this report starts with a smartphone teardown of the Vivo X90, showing detailed ICs around the SoC. We then feature multiple analyses from FEOL of the TSMC 4nm process on SoC die, as well as a back-end construction analysis for SoC packaging structure. This report also includes a detailed study of the SoC die and its cross-sections. In addition to a complete analysis by using SEM cross-sections, material analyses, and delayering, we show a high-resolution TEM cross-section of TSMC’s 4nm technology. A CT-scan (3D X-ray) is provided to reveal the layout structure of the SoC die package, and the floorplan of the SoC die is presented for a clear view of IP blocks. Furthermore, a comparison of TSMC 5nm vs. 4nm in TEM-view is included, and we also compare the packaging, die manufacturing, and floorplan of the 9200 SoC to its predecessor. Lastly, this report furnishes a complete cost analysis and a selling price estimation.

• MediaTek
• TSMC
• Samsung

Key Features

• Vivo X90 smartphone teardown
• Detailed photos
• Precise measurements
• Front-end structural analysis with SEM
• TEM analysis & TSMC 5/4 nm FinFET comparison
• Floorplan
• Comparison of packaging, die, and floorplan between Dimensity 9000 and 9200
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis

What's new

• The newest high-end generation of MediaTek’s smartphone processor
• Most advanced chip architecture – e.g., Arm Cortex-X3, 8-channel UFS 4.0, MediaTek’s latest APU 690, and the first Wi-Fi-7
• The SoC is manufactured with TSMC’s most advanced 2^nd-generation 4nm FinFET technology
• New packaging structure for better mechanical reliability
• New cost-effective die process compared to its predecessor

Overview  

• Executive Summary
• Product Specification
• Reverse Costing Methodology
• Glossary

Company Profile 

• Company Profile
• MediaTek Dimensity Series
• Market Analysis

Physical Analysis 

• Smartphone Dismantle
  • Components on the Smartphone Main Board
• Packaging Analysis
• DRAM Die
• SoC Die
• FEOL
  • TEM Analysis with TSMC 5/4 nm Comparison
• Floorplan

Physical Comparison (Dimensity 9000 vs. 9200)

• Packaging Comparison
• Die Comparison
• Floorplan Comparison

Manufacturing Process  

• Global View
• SoC Die Wafer Fabrication Unit
• SoC Die Front-End
• Advanced PoP BGA Packaging Process

Cost Analysis 

• Summary
• Yields Explanation & Hypotheses
• Front-End Wafer Cost
• SoC Die Cost
• Packaging Cost
• Component Cost

Selling Price  

• Definitions of Price
• Manufacturer Financials
• Estimated Selling Price

Feedbacks 

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