Technology, Process and Cost

MediaTek Dimensity 9200 SoC

By Yole SystemPlus

A full physical and cost analysis of MediaTek’s flagship smartphone processor. A comparison with its predecessor reveals MediaTek’s remarkable capacity for design progression


Key Features

  • Vivo X90 smartphone teardown
  • Detailed photos
  • Precise measurements
  • Front-end structural analysis with SEM
  • TEM analysis & TSMC 5/4 nm FinFET comparison
  • Floorplan
  • Comparison of packaging, die, and floorplan between Dimensity 9000 and 9200
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's new

  • The newest high-end generation of MediaTek’s smartphone processor
  • Most advanced chip architecture – e.g., Arm Cortex-X3, 8-channel UFS 4.0, MediaTek’s latest APU 690, and the first Wi-Fi-7
  • The SoC is manufactured with TSMC’s most advanced 2nd-generation 4nm FinFET technology
  • New packaging structure for better mechanical reliability
  • New cost-effective die process compared to its predecessor

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