Technology, Process and Cost
Murata LBAD0XX1SC NB-IoT Module
By Yole SystemPlus —
The world’ smallest LTE Category M1/Narrow-band Internet of Things module with global certification and Global Positioning System support
SPR23754
- Altair/Sony
- Murata
- Skyworks
- Tower Semiconductor
- Winbond
Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Summary of the physical analysis
- Module Disassembly
Physical Analysis – Murata 1SE
- Packaging
- Views and Dimensions
- Marking & Opening
- Cross-section
- Die – Altair ALT1250
Physical Analysis – Skyworks SKY68020-11
- Packaging
- Views and Dimensions
- Marking & Opening
- Cross-section
- Die – Power Amplifier
- Views and Dimensions
- Cross-Section
- Die – MIPI/PMIC, Switch
- Views and Dimensions
- Delayering
- Cross-Section
- Die – Baluns
- Views and Dimensions
- Cross-Section
Manufacturing Process Flow Analysis
- Global Overview
- PA Die Front-End Process
- PA Die Front-End Wafer Fabrication Unit
- MIPI/PMIC Die Front-End Process
- MIPI/PMIC Die Front-End Wafer Fabrication Unit
- Switch Die Front-End Process
- Switch Die Front-End Wafer Fabrication Unit
- Balun #1 & #2 Die Front-End Process
- Balun #1 & #2 Die Front-End Wafer Fabrication Unit
- Summary of Inputs
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Cost Summary
Cost Analysis – Skyworks SKY68020-11
- Die Cost Analysis
- PA Die Front-End Wafer Cost
- PA Die Front-End Steps Cost
- PA Die Cost
- MIPI/PMIC Die Front-End Wafer Cost
- MIPI/PMIC Die Cost
- Balun #1 Die Front-End Wafer Cost
- Balun #1 Die Cost
- Balun #2 Die Front-End Wafer Cost
- Balun #2 Die Cost
- Switch Die Front-End Wafer Cost
- Switch Die Cost
- Packaging Cost
- Component Cost
Cost Analysis – Murata 1SE
- Packaging Cost
- Component Cost
Selling Price – Skyworks SKY68020-11
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Selling Price – Murata 1SE
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedback
About Yole Group
For Low power devices such as wearables, medical, smart meter and asset tracker, RF components requires a specific design to provide M2M or M2X connectivity. Unlike consumer devices such as smartphones, these system uses narrow band in the LTE frequency band to provide long range communication at low consumption. With a lost in transmit data rate, the RF components are known to be low-cost devices.
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Murata LBAD00XX1SC. The Type 1SC (LBAD00XX1SC) module is the world’s smallest Cat. M1/NB-IoT module with global certification and GPS supports. This study aims to provide an estimation of the final component price with a complete analysis of the FEM from Skyworks.
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis