Technology, Process and Cost
NVIDIA DPU BlueField-3
Detailed physical data, data processing unit architecture analysis and cost structure of NVIDA’s latest generation of BlueField
SPR25933KEY FEATURES
- Latest NVIDIA Network ASIC
- Detailed optical and SEM photos
- Precise measurements
- Die analysis
- Package analysis
- CoWoS manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Floorplan
Product objectives
- Exploring the technology behind the latest NVIDIA DPU generation (Network IC)
- Insight into the DPU technology used by leading players
- A comprehensive study of the physical structure and detailed data on chip packaging, DPU dies
- A detailed perspective on the DPU IP architecture, clearly highlighting the area allocation for the data processing cluster
- In-depth analysis of IP design with precise core dimension measurements
- Overview of NVIDIA DPU manufacturing supply chain
- Analyze the economic factors of BlueField-3 DPU within the semiconductor industry and the Network ASIC market
This full reverse costing study provides insights regarding the technology data, manufacturing cost, and selling price of the NVIDIA BlueField-3 data process unit (DPU).
NVIDIA’s BlueField-3 DPU represents a significant evolution in data processing unit (DPU) architecture, purpose-built to offload, accelerate, and isolate data center infrastructure workloads. As the third generation in the BlueField family, BlueField-3 is manufactured using TSMC’s advanced node and features major improvements in compute density, security processing, and AI-powered telemetry. With the Arm A78 core design, integrated accelerators for networking, storage, and security, and a programmable architecture, it delivers up to 400 Gbps of network throughput and supports complex workloads such as zero-trust security and software-defined networking. In the smartNIC market segment, BlueField-3 serves as a key enabler of next-generation, cloud-scale infrastructure by transforming traditional NICs into full-fledged infrastructure processors capable of securing artificial intelligence workload isolation at the edge of the network.
In this report, we perform an in-depth physical analysis using high-resolution imaging techniques, including optical microscopy (OM) and scanning electron microscopy (SEM), to investigate the chip’s packaging and die structure. The report also presents a floorplan study that outlines the core layout and the allocation of hardware accelerators and security IP blocks. Finally, we provide a detailed cost structure breakdown, covering material costs, manufacturing processes, and assembly expenses, offering a comprehensive understanding of the technological complexity and economic considerations driving this advanced data center chip.
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
- NVIDIA Financials
- NVIDIA Products
- Market analysis
Physical Analysis
- System Teardown
- Package Analysis
- DPU Die
- DPU Floorplan
Manufacturing Process Flow Analysis
- Summary
- Front-End Process
- Wafer Fab Unit
- Back-end
- Assembly & Final Test
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- DPU Die
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
Feedbacks
Related Report
About Yole Group
