Technology, Process and Cost

OmniVision’s OVM6948 CameraCubeChip

By Yole SystemPlus

The smallest camera in the world for endoscopes is based on a fully wafer bonded technology, with CIS, packaging and optic on the same wafer.

Reverse costing with:

  • Analysis of the camera module structure, including CIS, WLP and WLO
  • Detailed optical and SEM photos
  • Precise measurements
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated selling price
  • Technology comparisons between the new Xintec WLP and VisEra WLO technologies and the older CameraCubeChip model

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