Technology, Process and Cost Comparison

Optical MEMS Comparison 2026

Technology, supply chain, and cost comparison of eight optical MEMS for LiDAR, VOA, and optical switch applications from Mirrorcle, RoboSense, O-Net Technologies, Lumentum, Agiltron, Santec, and DiCon Fiberoptics.

SPR26024

SCOPE

Analyzed devices

  • LiDAR mirror: Mirrorcle A7M20.2, RoboSense M1PG2409
  • VOA: O-Net Technologies 1GS-102010, Lumentum MAT826349 Agiltron U 57071, Santec MOVA-HC-1
  • OS: DiCon Fiberoptics 603DM0 OE-Photonics V00527 

From module/end system

  • RoboSense MX LiDAR
  • Zvision ML-30s Short-Range LiDAR

PHYSICAL ANALYSIS

  • Detailed photos in optical and SEM views
  • Precise thickness measurements
  • Package opening
  • Material identification

Technology 

  • MEMS:
    • Electrostatic actuation
    • Electromagnetic actuation
    • Electrothermal actuation 
  • Diode

Type of Analysis

  • Optical View
  • X-ray View
  • SEM View
  • EDX View
  • Cross-section
  • Delayering

MANUFACTURING PROCESS FLOW

  • Recreation of manufacturing process flow
  • Step by step process flow

Technical analysis

  • Module​
  • Component​
  • Process​
  • Wafer​
  • Material​
  • IP
  • Packaging

COST ANALYSIS

  • Supply chain evaluation
  • Simulation of MEMS wafer and die cost

Type of Analysis

  • Raw wafer cost
  • Wafer Front-End cost
  • Die cost
  • Give a general physical analysis of 2 LiDAR mirrors, 4 VOAs, 2 OS based on MEMS technology used for automotive, data centers, and communication purposes.
  • Present an overview of the approximate manufacturing process flow for the analyzed optical MEMS.
  • Provide a physical and manufacturing cost comparison among the analyzed optical MEMS. 

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