Technology, Process and Cost
Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
By Yole SystemPlus —
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip
Last year, ahead of its competitors, Apple introduced front 3D depth sensing in its flagship model, the iPhone X. Following this trend, Chinese players like Vivo, Xiaomi, Huawei and Oppo also decided to integrate such modules, providing new features for security or entertainment in their flagships. For the first Oppo smartphone sold in Europe, the Find X, Orbbec has been chosen to provide the complete 3D solution. Working together with a custom system-on-ship (SoC) and a global shutter (GS) near infrared (NIR) camera module, the dot projector is the first to use a camera module assembly configuration for structured light illumination.
Located in the Find X’s front side, around the speaker, the 3D system is packaged in one metal enclosure. The system features a dot projector, a flood illuminator, a red/green/blue camera and a NIR camera sensor. An additional SoC component is soldered on the main board to process the signal from the latter devices.
The system uses standard components found on the market. That includes a GS image sensor featuring 3µm size pixels and standard resolution of 1 megapixel and a vertical cavity surface emitting laser (VCSEL). The system is therefore very cost efficient compared to other solutions. The camera and dot projector module assembly uses standard wire bonding to connect the sensor or the VCSEL dies, along with an optical module comprising four lenses for both modules.
This report analyzes the complete 3D depth sensing system, including a complete analysis of the NIR camera module, the dot projector and the SoC, along with cost analysis and price estimation for the system. It also includes a physical and technical comparison with other 3D sensing systems, such as those from Apple in the iPhone X. The comparison looks at system integration, the NIR camera module and the dot projector architecture.
REVERSE COSTING WITH
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated sales price
- Comparison with Apple iPhone X 3D sensing solution
Introduction
Company Profile
Oppo Find X – Teardown
Market Analysis
Physical Analysis
- Physical Analysis Methodology
- NIR Camera Module Disassembly and Cross-Section
- Sensor Die
- View, dimensions, pixels, pads, markings, die process and cross-section
- DOT Projector Module Disassembly and Cross-Section
- NIR VCSEL Die
- View, dimensions, die process and cross-section
- Orbbec MX6300B – Component Analysis
- Package/die view and dimensions
- Die delayering, main block IDs and structural blocks
- Die process and cross-section
- Physical Data Summary
Physical Comparison: Apple iPhone X
- System Integration
- NIR Camera Module and Sensor
- Dot Projector Module and VCSEL
Manufacturing Process Flow
- Die Fabrication Unit : NIR Image Sensor, NIR VCSEL, Orbbec SoC
- NIR VCSEL Process Flow
Cost Analysis
- Cost Analysis Overview
- Supply Chain Description and Yield Hypotheses
- NIR Image Camera Module Cost
- Front-end (FE), microlens and total FE cost
- Wafer and die cost
- Lens module and assembly cost
- NIR VCSEL Die Cost
- Front-end (FE), wafer and die cost
- Front-end cost per process steps
- Lens module and assembly cost
- SoC Die Cost
- Front-end (FE), wafer and die cost
- Packaging and component cost