Polymeric Materials for Advanced Packaging 2025

• Provide detailed analysis regarding the applicability of polymeric materials for Advanced Packaging applications: dielectrics, moldcompounds, underfills and temporary bonding materials​

• Detailed analysis of the major Advanced Packaging platforms that require the use of polymeric material​

• Polymeric materials roadmap for the Advanced packaging platforms​

• Analyze the status of polymeric material adoption and the various types of polymeric materials available in the market​

• Provide an overview of the technological trends for polymeric materials​

• Understand the key benefits and added value of polymeric material in the field of Advanced Packaging​

• Understand what the remaining challenges are for the implementation of polymeric material in Advanced Packaging​

• Provide market metrics of the polymeric material markets (volume, revenue) for Advanced Packaging (2020-2025-2030):​

  • By material function ​

  • By Advanced Packaging platform​

  • By end-market​

• Provide the competitive landscape and identify key players in technology development and manufacturing​

• Estimate polymeric materials suppliers’ market shares by material type​

• Power Packaging​

• Wire bond packages, QFN, ceramic packages​

• IC substrate materials​

• Die-to-die assembly process​

Key features:

• Analysis of the applicability of polymeric materials in Advanced Packaging: dielectric, mold compound, underfill and temporary bonding materials
• Market forecast for each material type, by end-market and packaging platform
• Overview of the technology trends for polymeric materials
• Supply chain analysis and key players description
• Polymeric materials suppliers’ market shares by material type
• Scope of analysis including wafer level and panel level packaging (all advanced packaging landscape)
• Brief discussion on emerging technologies like panel level packaging and CPO

Polymeric materials for advanced packaging reached $1.6B in 2024, 13% CAGR expected

Semiconductor megatrends – automotive/ADAS, HPC, generative AI, AR/VR, mobile & edge AI, IoT are reshaping advanced packaging, driving more demanding material requirements for higher performance devices. Polymeric materials, including dielectrics, mold compounds, underfills and temporary bonding materials for advanced packaging, reached almost $1.6B revenue in 2024 and are expected to achieve about $3.3B in five years, growing with 13.2% CAGR. Mobile & consumer leads the market in volumes and revenues, but telecom and infrastructure is growing the fastest, driven by high-performance packaging for HPC and generative AI. System-in-Package (SiP) remains the dominant platform for polymeric materials,while 2.5D and 3D packaging are the fastest growing segments, showing the highest CAGR2024-2030 of 35% in volume and 28% in revenue.

Advanced materials enabling finer pitch, higher reliability, and sustainable packaging

The datacenter AI wave is reshaping semiconductors and advanced packaging, pushing for more compute, faster I/O,higher power efficiency, and superior thermal management. Materials must now deliver better mechanical properties and superior reliability, high thermal conductivity, thermal stability, compatibility with larger dies/chiplets, tighter warpage control, finer lithography patterning, and denser interconnects via RDL, interposers, and hybrid bonding. Key materials likepolyimides (PI), PBO, BCB, epoxy and acrylic resin composite systems, thermoplastic polymers, are widely used in advanced packaging as dielectrics, mold compounds, underfills and temporary bonding materials. A core material challenge islowering the CTE (coefficient of thermal expansion) mismatch, since polymers expand far more than silicon, driving stress,warpage, and defects. However, because no single recipe meets all targets, the solution is application-specific formulations that balance performance trade-offs for each customer and package architecture.

Global Leaders, Niche Specialists, and the Push for PFAS-Free Innovation​

The advanced packaging polymeric materials market features a diverse yet concentrated supply chain, with the top fiveplayers (Resonac, Henkel, Panasonic, Sumitomo, and HD Microsystems) together accounting for over 50% of global revenues. Despite the wide range of suppliers, the market is dominated by Japan, which captures around 80% of total revenue across dielectric materials, mold compounds, underfills, and temporary bonding solutions. Germany follows withroughly 10% market share, driven by Henkel, while the U.S. holds about 5%, led by 3M (temporary bonding) and Qnity(Dupont) (dielectrics). China accounts for around 4%, anchored by Huahai Chengke in mold compounds and Samcien intemporary bonding materials. Across all segments, suppliers are adapting portfolios to align with AI/HPC-driven packaging while responding to PFAS-free material demands. Collaboration across material, equipment, and packaging suppliers is crucial for driving innovation in advanced semiconductor packaging.

​​​​

3M, AEMC, AI Technology, Ajinomoto, AMD, Amkor Technology, AOI Electronics, Applied Materials, AsahiKasei, ASE, Brewer Science, Caplinq, Chang Chun Group, Chang Wah Electromaterials, CXMT, DELO, DecaTechnologies, Dupont, Empower Materials, Eternal Materials, Everlight Chemical, Fujifilm, GlobalFoundries,HD Microsystems, Henkel, Hysol, IBM, Imec, Innolux, Intel, JCET, JSR, KCC, Kayaku Advanced Materials,Kyocera, MacDermid Alpha, Manz, Merck, Micro Materials, Micron, Minseoa, Mitsubishi Gas Chemical, MitsuiChemicals, Mingkun Technologies, Murata, Nagase ChemteX, Namics, Nepes, Nippon Shokubai, NissanChemical, Nitto Denko, Nvidia, Panasonic, PEP, PhiChem, Powertech Technology (PTI), Pulse Forge, QnityElectronics, Qorvo, Resonac, Samcien, Samsung Electronics, Sanyu Rec, Sekisui, Shin-Etsu, SiPLP, SJSemiconductor, SK Hynix, Smartkem, SPIL, STMicroelectronics, Sumitomo Bakelite, Taiflex, Taiyo Holdings,Texas Instruments, TianShui Huatian (and HT-Tech), TOK, Tongfu Microelectronics, Toray, TSMC, U-PAK, UMC,WaferChem, Winscene Technology, Yincae, and more​