Technology, Process and Cost
Power Module for Honda e:HEV Hybrid System
Industry-first deep-dive analysis of the unique multi-function integrated power module used in Honda’s e:HEV hybrid system.
SPR26700PHYSICAL ANALYSIS
Gain direct insight into the Honda e:HEV power module architecture through a comprehensive physical and material investigation. This analysis provides a deep understanding of the package design, semiconductor integration, cooling structure, and assembly technologies used within the module.
Analysis Includes
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening and cross-section
- Die delayering and cross-section
- Material identification, EDX Analysis
Technology
- Semiconductor die
- Direct-cooled structured-fin Module. Unique design with multi-functional blocks.
Type of Analysis
- SEM View
- Cross section
- Delayering
- Optical View
- EDX Analysis
MANUFACTURING PROCESS FLOW
Detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
Technical analysis
- Module​
- Process​
- Wafer​
- Die
- Material​
- Packaging
COST ANALYSIS
Understand the economic structure of the Honda e:HEV power module through a complete cost and supply chain assessment. This analysis delivers a detailed breakdown of manufacturing costs at every level, from wafer fabrication to final module assembly and price estimation
Type of Analysis
- Yields
- Raw wafer cost
- Epi-wafer and Wafer Front-End cost
- Die cost breakdown
- Dicing & Probe test cost
- Package assembly cost
- Final test cost
- Module cost breakdown and price estimation
Report's objectives
- Provide a comprehensive reverse costing study of the multi-function integrated power module used in Honda’s e:HEV hybrid system.
- Provide exhaustive physical and technology analysis (Optical and scanning electron microscope (SEM) images with EDX material analysis) from the module’s opened package, down to the microscopic level of die design.
- Analyze the packaging innovations and the integration strategy behind the multi-function integrated power module.
- Provide a detailed analysis of the design of dies.
- Provide detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
- Provide an exhaustive cost analysis: FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module cost breakdown, and price estimation with a detailed Yield model for each process cost sequence (Wafer, die, packaging)
Tightening environmental regulations aimed at reducing average COâ‚‚ emissions are accelerating the global shift toward vehicle electrification. This regulatory pressure is driving increased adoption of electric and hybrid electric vehicles, including BEVs, PHEVs and HEVs. In this context, Yole Group forecasts that the xEV market will reach 61.0 million vehicles by 2030, with Hybrid Electric Vehicles accounting for 9.3 million units.
Honda was among the first automakers to introduce hybrid electric vehicle technology in Europe, with the launch of the Honda Insight in 1999. Since then, the company has continued to develop its hybrid strategy through the e:HEV platform, which combines electric-drive smoothness with hybrid efficiency. In this architecture, the vehicle automatically switches between EV Drive, Hybrid Drive and Engine Drive modes to optimize the use of the electric motor and internal combustion engine according to driving conditions. This makes the Power Control Unit and its integrated power electronics a critical element of system performance, efficiency and reliability.
In this context, Yole Group analyzes the power module found in the Keihin Power Control Unit of the Honda Civic e:HEV hybrid system. The full teardown of the complete system is available on Yole Group’s website. The Civic e:HEV PCU uses a multi-function integrated power module that combines the main power-conversion functions of the hybrid system: the generator-motor inverter, the traction/drive-motor inverter, and the step-up / step-down converter. This architecture illustrates the industry’s move toward compact, highly integrated and high-performance power electronics solutions, while leveraging the advantages of semiconductor chip technology, advanced interconnects and ceramic substrates. The module demonstrates a high level of functional integration, with optimized internal current routing, repeated power-cell building blocks, and packaging choices designed to support thermal, electrical and mechanical performance.
Yole Group delivers a comprehensive reverse-costing study of this multi-functional power module, detailing its internal architecture, die technology and packaging innovations. Supported by a complete teardown and physical analysis, including module opening, deprocessing, cross-sections, optical microscopy, SEM imaging and EDX analyses of both package and die structures, this report reveals the key technology choices implemented in the module.
The report provides insights into the module’s design, materials, semiconductor technology, interconnect strategy and packaging approach. It also includes a simulated manufacturing cost analysis of the module and its subcomponents, as well as an estimated selling price for the final power module.
Included is a detailed teardown of the module, highlighting its design and material choices, together with a step-by-step manufacturing process flow and cost breakdown for the main module parts. The study provides valuable intelligence for stakeholders across the electrification supply chain, from OEMs and Tier-1 suppliers to power module manufacturers, packaging solution providers and material suppliers, as they navigate the evolving xEV market and power electronics technology landscape. Additionally, this Multi-functional power module will be featured in the upcoming “Automotive Power Module Packaging Comparison 2026”, where it will be benchmarked against competing solutions from other leading manufacturers.
- Package View & Opening
- Package Cross-Section
- Die Views & Dimensions, Die Delayering
- Die Cross Section
Honda