Technology, Process and Cost
Qualcomm SA8295P SoC in Snapdragon Cockpit Platform
By Yole SystemPlus —
A full physical and cost analysis of Qualcomm SA8295P SoC in Snapdragon Cockpit Platform
SPR24802
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile & Market
- Company Profile
- Market Analysis
Physical Analysis
- Module Disassembly
- Package Assembly
- SoC Die
- SoC Floorplan
Manufacturing Process Flow Analysis
- Summary
- SoC Die Front-End Process
- SoC Die Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Back-End 0 Wafer Cost
- Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
Newest Qualcomm Snapdragon cockpit platform
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Qualcomm SA8295P in Snapdragon cockpit platform.
For automotive processors, each chip manufacturer has its own leadership in different applications. As an IC design giant, Qualcomm has been developing several platforms crossing from ADAS, infotainment and telematics system. For cockpit application, Qualcomm is the captain in 2022 that accounted around 26% market share. The first generation of Snapdragon cockpit platform using a 28 nm system-on-chip (SoC) was release in 2017. In the most recent 4th generation, Qualcomm moves forward to a 5 nm SoC, SA8595P, to boost the chip performance. To realize a high-performance computing for supporting advanced AI and visual performances in cockpit, Qualcomm develops a multi-domain intellectual properties in the SoC die.
From the public information and our analysis, the SoC die is assumed to be manufactured by using TSMC 5 nm FinFET technology. In this report, we conduct a full physical analysis to understand the advanced automotive SoC from packaging, die manufacturing to floorplan by using X-ray, optical microscope and scanning electron microscope (SEM). In addition, detailed measurements on the chip structure are provided in our analysis. Besides a complete floorplan on the SoC die is included to disclose Qualcomm’s self-developed IP configuration. Last but not least, we furnish the report with a full cost analysis and price estimation of the component.
- Qualcomm
- TSMC
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- SoC die floorplan
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
What's New
- The newest version of Qualcomm Snapdragon cockpit platform
Product Objectives
- Provide technology data, manufacturing cost and selling price.
- Teardown details on Qualcomm 4th Gen. SA8295P Automotive Cockpit Platform to reveal the components supporting the SoC on the module board
- Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
- Clear view on the technology and supply chain.
- SoC package size, die size, die delayering to reveal the manufacturing
- SoC floorplan to reveal the IP architecture.
- Automotive SoC manufacturing, its supply chain and cost structures.