Qualcomm Snapdragon 8 Gen 1 SoC

Overview

• Executive Summary
• Product Specification
• Reverse Costing Methodology
• Glossary

Company Profile

• Company Profile
• Qualcomm Snapdragon Series
• Market Analysis

Physical Analysis

• Smartphone Teardown
• Packaging Analysis
• DRAM Die
• SoC Die
• FEOL (TEM)
• Floor Plan

Manufacturing Process Flow Analysis

• Global Overview
• SoC Die Front-End Process
• SoC Die Front-End Wafer Fabrication Unit
• Advanced PoP BGA packaging process

Cost Analysis

• Cost Summary
• Yields Explanation & Hypotheses
• Soc Die Front-End Wafer Cost
• SoC Die Cost
• Packaging Cost
• Component Cost

Selling Price

• Definitions of Price
• Manufacturer Financials
• Estimated Selling Price

Feedbacks

Related Products

About Yole Group

• Qualcomm
• Samsung

Qualcomm’s CQ2-22 handset revenues were more than 50% higher than in CQ2-21, rising on the back of strong demand for high-end 5G Snapdragon processors like the Snapdragon 8 gen-1.  Looking at the market as a whole, Yole analysts expect smartphone application processor revenue to reach $40 billion in 2022.

This full reverse costing study was conducted to provide insight regarding the technology data, manufacturing cost, and selling price of the Qualcomm Snapdragon 8 Gen-1 system-on-chip (SoC).

At the beginning of 2022, Qualcomm released its newest SoC for mobile platform: Snapdragon 8 Gen-1. This advanced generation is equipped with Qualcomm’s updated Kryo CPU based on Arm Cotex-X2 technology, the re-architected Adreno GPU which is the first Snapdragon platform to showcase Unreal Engine 5: the fastest 7^th-generation Al engine and the most powerful 5G platform with the Snapdragon X65 5G Modem-RF system. This chip also features the leading Wi-Fi 6 & 6E with multi-gig speeds. Compared to its precursor, the CPU reaches from 2.8 GHz to 3.0 GHz, and the GPU is 25% more efficient, delivering 50% faster graphics rendering. Plus, with the innovations in AI and the first-ever 18-bit ISP, Qualcomm has built Snapdragon 8 Gen-1 as an outstanding platform for gaming, audio, and other multimedia experiences.

The Snapdragon 8 Gen-1 SoC contains an SRAM cache in the die and includes an external LPDDR5 DRAM with packaging. The advanced ball-grid-array packaging technology is used for integrating the SoC die with upper and bottom substrate, and the DRAM package is stacked on the SoC die package with PoP (package-on-package) technology. The SoC die is fabricated by Samsung on 4nm process, which is also used to manufacture Samsung’s Exynos 2200 SoC. Snapdragon 8 Gen-1 SoC is the heart of several high-end smartphones, such as the U.S. version of the Samsung Galaxy S22 series and the XIAOMI 12 Pro smartphone.

To reveal all the details of the Snapdragon 8 Gen-1, this report features multiple analyses. One is a front-end construction analysis to reveal the key features of the Samsung 4nm process, and another is a back-end construction analysis for packaging structure. Moreover, this report includes a detailed study of the SoC die and its cross-sections. In addition to a complete analysis by using SEM cross-sections, material analyses, and delayering, we show a high-resolution TEM cross-section of the Samsung 4nm technology. CT-scan (3D X-ray) is also provided to reveal the layout structure of the SoC die package. Furthermore, the floorplan of the SoC die is presented to provide a clear view of IP blocks. Lastly, this report furnishes a complete cost analysis and a selling price estimation of the Snapdragon 8 Gen-1 SoC.

KEY FEATURES

• Detailed photos
• Precise measurements
• Front-end structural analysis with TEM
• Back-end structural analysis with CT scan
• Floorplan
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis

Available on our Yole Group All-Inclusive Computing Package