Technology, Process and Cost
Qualcomm Snapdragon 8 gen 3 SoC
By Yole SystemPlus —
A physical analysis and cost analysis of the most advanced smartphone SoC from Qualcomm.
SPR24801
Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Profile
- Qualcomm Snapdragon Series
- Market Analysis
Physical Analysis
- Xiaomi 14 Smartphone Teardown
- Packaging Analysis
- DRAM Die
- SoC Die
- FEOL
- Floorplan
Physical Comparison (Snapdragon 8 Gen 2 vs. Gen 3)
- Packaging Comparison
- Die Comparison
- Floorplan Comparison
Manufacturing Process
- Global View
- SoC Die Wafer Fabrication Unit
- SoC Die Front-End
- Advanced PoP BGA Packaging Process
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Report
About Yole Group
The most advanced version of smartphone SoC from Qualcomm
This full reverse costing study was conducted to provide insights regarding the technology data, manufacturing cost, and selling price of the Qualcomm Snapdragon 8 Gen 3 system-on-chip (SoC).
In 2021, Qualcomm introduced the first Snapdragon 8 series and continues to developed this series dedicated to smartphone application. Followed by Qualcomm’s roadmap, the Gen 3 was thus introduced in 2023. According to Qualcomm, this newest version is manufactured by using TSMC 4 nm technology, same as Gen 2 and Gen 1 plus. However certain upgrades are implemented in the die architecture. The Gen 3 is embedded with an updated AI engine and a new CPU design. In this report, a floorplan comparison is presented to understand the evolution of the Snapdragon 8 SoC family.
The package structure of Snapdragon 8 Gen 3 is similar to its predecessor. The SoC die contains SRAM caches while the chip integrates an external LPDDR5X DRAM by using package-on-package (PoP) technology. The SoC die is firstly assembled by using advanced ball-grid-array (BGA) packaging technology, then the DRAM package is stacked on the top.
This report starts with the smartphone teardown on Xiaomi 14 to show how Snapdragon 8 Gen 3 and other components around are integrated onto the main board of the phone. Then the report provides multiple analyses from SoC assembly to the back-end construction and front-end-of-line (FEOL). We conducted detailed studies of chip packaging and SoC die cross-sections by using computed tomography scan (CT-scan), optical microscopy, Scanning Electron Microscopy (SEM), material analyses and delayering. Moreover, a high-resolution Transmission Electron Microscopy (TEM) analysis is included to show the TSMC 4nm FinFET structure. A floorplan study of SoC die offers a clear view of Intellectual Property (IP) design. In the end of the physical analysis, we present a physical comparison of packaging, die manufacturing and floorplan between Gen 2 and Gen 3. Lastly, this report furnishes a complete cost analysis and a selling price estimation.
- Qualcomm
- TSMC
Key Features
- Detailed photos
- Precise measurements on package and SoC die analysis
- Materials analysis
- SoC die floorplan
- Package/die/floorplan comparison with the predecessor
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
What's new?
- Analysis on the most recent Qualcomm advanced SoC for smartphone application
Product Objectives
- Provide technology data, manufacturing cost and selling price.
- Teardown details on Xiaomi 14 to reveal the components supporting the SoC on the main board of the phone
- Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
- TSMC 4 nm FEOL analysis with transmission electron microscopy (TEM).
- Clear view on the technology and supply chain.
- SoC package size, die size, die delayering to reveal the manufacturing
- SoC floorplan to reveal the IP architecture.
- Smartphone SoC manufacturing, its supply chain and cost structures.