Technology, Process and Cost

Renesas DA14706 Bluetooth 5.2 SoC with PMU & GPU

By Yole SystemPlus

Renesas DA14706 Multi-Core Wireless SoC with PMU and GPU


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

Product Objectives

  • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the multi-core wireless SoC with PMU and GPU DA14706 from Renesas.

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