Technology, Process and Cost
Renesas DA14706 Bluetooth 5.2 SoC with PMU & GPU
By Yole SystemPlus —
Renesas DA14706 Multi-Core Wireless SoC with PMU and GPU
SPR23784
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the multi-core wireless SoC with PMU and GPU DA14706 from Renesas.
The DA1470x is a family of multi-core wireless microcontrollers, combining the latest Arm Cortex M33TM application processor with floating-point unit, advanced power management functionality, a Graphic Processing Unit (GPU) for advanced graphics processing, a cryptographic security engine, analog and digital peripherals, a dedicated sensor node controller, and a software configurable protocol engine with a radio that is compliant to the Bluetooth® 5.2 low energy standard.
The DA14706 integrates External PSRAM with DATA Cache, JEITA charger, boost DCDC converter.
Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
- Renesas
Physical Analysis
- Summary of the physical analysis
- Packaging Analysis
- IC Die Analysis
- IC Characteristics
Manufacturing Process Flow Analysis
- Global Overview
- IC Die Front-End Process
- IC Die Front-End Wafer Fabrication Unit
- Packaging process
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- IC Die Front-End Wafer Cost
- IC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
Product Objectives
- This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the multi-core wireless SoC with PMU and GPU DA14706 from Renesas.
- Renesas Semiconductor
- TSMC