Samsung Exynos 2200 System-on-Chip

Key Features

• Detailed photos
• Precise measurements
• Front-end structural analysis with TEM
• Back-end structural analysis with CT scan
• Floorplan (2nd version)
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis

Available on our Yole Group All-Inclusive Computing Package

Overview / Introduction

• Executive Summary
• Product Brief
• Reverse Costing Methodology
• Glossary

Company Profile

• Company Profile 
• Smart Phone Application Processor 
• Market Analysis

Physical Analysis

• Smartphone Teardown 
• Exynos 2200 Package Analysis 
  • Views & Dimensions
  • CT-Scan Image
  • Cross-Section
• DRAM Die 
  • View & Dimensions
  • Cross-Section
• Exynos 2200 SoC Die 
  • Views & Dimensions
  • Delayering
  • Die Process
  • Die Cross-Section
• FEOL TEM images
• Floor Plan 

Manufacturing process 

Global Overview

Exynos 2200 SoC Front-End

Exynos 2200 SoC Wafer Fabrication Unit

Advanced Embedded Packaging Process

Cost Analysis 

Cost Analysis Summary 

Yields Explanation & Hypotheses

Exynos 2200 SoC Wafer Cost

Exynos 2200 SoC Die Cost

Packaging Cost

Component Cost

Selling Price 

Feedback 

Related Analysis 

System Plus Consulting Services 

In the constant race to smaller lithography, Samsung shows its place with the Exynos 2200 – the first SoC on 4nm. This application processor includes the first GPU co-designed by the partnership of Samsung and AMD, which helps keep Samsung’s smartphone processor competitive in a market that is earning chip vendors in excess of $10 billion per quarter.

This full reverse costing study was conducted to provide insight regarding the technology data, manufacturing cost, and selling price of the Exynos 2200 system-on-chip (SoC).

Samsung is one of the biggest smartphone manufacturers, and developed the leading-edge system-on-chip (SoC) to power its smartphone models. Starting from 2010, Samsung launched its ARM-based Exynos SoC and integrated it into the Galaxy series. In 2022, the most advanced generation – the Exynos 2200 SoC – was born, and now drives part of the Galaxy S22 5G smartphone. This latest chip is equipped with one ARM Cortex-X2 CPU, three Cotex-A710s, and four Cortex-A510s. Apart from the previous version (which uses ARM Mali GPUs), Samsung is collaborating with AMD and designing its own GPU (Xclipse 920) for running Exynos 2200. Regarding the AI engine, the chip includes a dual-core NPU and DSP, which is two times faster than its predecessor. According to Samsung’s official announcement, Exynos 2200 is fabricated using the Samsung foundry’s 4nm finFET technology.

The Exynos 2200 SoC contains a SRAM cache in the die, as well as an external LPDDR5 SDRAM with package. The advanced embedded packaging technology is used to assemble the SoC die with SoC substrates, and then the DRAM package is integrated with the SoC package by PoP (package-on-package) technology.

To reveal all the details of the Exynos 2200, this report features multiple analyses. One is a front-end construction analysis to reveal the key features of the Samsung 4nm process, and another is a back-end construction analysis for packaging structure. This report also provides a detailed study of the SoC die analyses and its cross-sections, along with a complete construction analysis by using SEM, EDS, and delayering. Moreover, a CT-scan (3D X-ray) of the whole chip package reveals the layout structure of the SoC die package. To understand Samsung’s very interesting 4nm process, we show a high-resolution TEM cross-section of the finFET technology from the Samsung Galaxy S22 Ultra 5G (international version). In the upcoming second version of this report, the floorplan of the SoC die will be updated to show a clear view of the IP blocks configuration. Lastly, this report furnishes a complete cost analysis and a selling price estimation of the Exynos 2200 SoC die.