Technology, Process and Cost

Samsung Exynos 2600 in Samsung Galaxy S26+

Jul 2026

Exynos 2600, Samsung's most powerful mobile SoC to date: architecture, GAAFET technology, AI capabilities, manufacturing cost, and selling price revealed.

SPR26054

SCOPE

Analyzed devices: Samsung Exynos 2600 SoC in Samsung Galaxy S26+

PHYSICAL ANALYSIS

Detailed photos in optical and SEM views
Precise thickness measurements
Package opening
Delayering
Material identification
TEM analysis

Technology

Samsung's first-generation 2nm GAA process
FO-WLP

Type of Analysis

SEM View
TEM View
Floorplan
Cross section
Delayering
Optical View
X-ray View
CT scan

MANUFACTURING PROCESS FLOW

Recreation of manufacturing process flow
Step by step process flow

Technical analysis

Module
Component
Process
Wafer
Material
IP
Packaging

COST ANALYSIS

Supply chain evaluation
Simulation of device cost

Type of Analysis

Die cost
Yields
Package assembly cost
Raw wafer cost
Wafer Front-End cost
Die cost
Dicing & Probe test cost
Package assemble cost
Final test cost

PRODUCT'S OBJECTIVES

Provide technology data, manufacturing cost and selling price.
Physical analysis of the package and die using X-ray, optical microscopy, and scanning electron microscopy (SEM).
Clear view on the technology and supply chain.
Package size, die size, die delayering to reveal the manufacturing
Floorplan to reveal the IP architecture.
The Samsung 2 nm GAAFET structure will be revealed through high-resolution TEM analysis.
A complete cost analysis and selling price estimation of the Samsung Exynos 2600 SoC.

Exynos 2600 SoC: Physical, Floorplan, TEM and Cost Structure Analysis

This full reverse costing study was conducted to provide insight regarding the technology data, manufacturing cost, and selling price of the Exynos 2600 SoC in Samsung Galaxy 26+.

The Exynos 2600 has been announced and manufactured using the industry’s first Samsung 2nm GAA (Gate-All-Around) process. Samsung states that the advanced 2nm GAA technology delivers high performance and improved power efficiency. The processor integrates a powerful deca-core CPU based on the latest Arm® v9.3 architecture, a high-performance NPU, and the Exynos Xclipse 960 GPU into a single compact chip to provide enhanced AI and gaming experiences.

Compared to its predecessor, the CPU delivers up to 39% higher computing performance, while the NPU improves generative AI performance by 113%. The Xclipse 960 GPU doubles computing performance and improves ray tracing performance by up to 50%, while supporting Exynos Neural Super Sampling (ENSS™). The Exynos 2600 also features AI-enhanced camera technologies, including Visual Perception System (VPS) and Deep-learning Video Noise Reduction (DVNR).

Another key feature is the Heat Path Block (HPB), a first in the mobile SoC industry, which optimizes the heat-transfer path and improves thermal dissipation efficiency through the application of High-k EMC. By lowering thermal resistance by up to 16%, the HPB enables faster heat transfer, helping maintain stable SoC temperatures and sustain high performance, even under demanding workloads such as high-end gaming and AI processing.

In this report, a teardown of the Samsung Galaxy S26+ is first presented to show how the Exynos 2600 is integrated on the main board alongside the other components. Then multiple analyses, ranging from back-end 0 construction to SoC die assembly, are presented. Also, we conducted the detailed studies in planar view and cross-section by using optical microscopy, computed tomography 3D scanning (CT-scan) and scanning electron microscope (SEM). Moreover, the Samsung 2 nm GAAFET structure will be revealed through high-resolution TEM analysis. A detailed floorplan study of SoC die is presented to understand the intellectual properties (IP) design in the processor. Lastly, this report gives a complete cost structure and a selling price estimation.