Technology, Process and Cost

Samsung FO-PLP for Google Pixel 7 Tensor G2 SoC

By Yole SystemPlus

A full physical and cost analysis of Google’s self-developed smartphone processor, as well as a comparison of high-end smartphone SoC packaging technologies


Key Features

  • Google Pixel 7 smartphone teardown
  • Detailed photos
  • Precise measurements
  • Front-end structural analysis with scanning electron microscopy
  • Transmission electron microscopy analysis of Samsung’s 5 nm FinFET
  • Floorplan
  • Comparison of high-end smartphone SoC packaging technologies
  • Comparison of packaging, die, and floorplan between Tensor G2 and Tensor G
  • Manufacturing process flow
  • Manufacturing cost analysis

What's new

  • The newest generation of Google’s high-end smartphone processor
  • New die architecture that boosts chip efficiency, security, and image processing
  • The first smartphone SoC assembled using Samsung’s FO-PLP technology

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