Technology, Process and Cost
SanRex 1200V SiC Module
By Yole SystemPlus —
Discover the unique TechnoBlock module packaging technology from SanRex, equipped with Panasonic’s DioMOS SiC MOSFET
SPR23697
- Panasonic
- SanRex
- Sansha Electric
- StarPower
Key Features
- Detailed optical and SEM photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Physical and cost comparison of 1200V SiC power modules from SanRex and StarPower
What's new
- SanRex’s Techno Block packaging technology
- Panasonic’s DioMOS SiC MOSFET technology
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
Physical Analysis
- Summary
- Package Analysis
- Package View & Opening
- Package Cross-Section
- SiC MOSFET Die Analysis
- Die Views & Dimensions
- Die Delayering
- Die Cross Section
Physical Comparison
- SanRex vs StarPower 1200V SiC modules Comparison
Manufacturing Process Flow
- SiC Wafer Fab Unit
- SiC Wafer Process Flow
- Assembly Unit
- Assembly Process Flow
Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- SiC MOSFET Wafer & Die Cost
- Packaging Cost
- Module Cost
Cost Comparison
- SanRex vs StarPower 1200V SiC modules Comparison
Selling Price
Feedback
Related Products
More About Yole Group
The SiC device market will reach $6B in 2027, according to Yole Intelligence’s Compound Semiconductor Monitor (Q4-2022).
The SiC ecosystem has been reshaped by the major SiC market players in recentyears. Every manufacturer has its own solutions for die design and packaging integration. This leads to strong competition, which will accelerate technical innovation and lower prices.
Although some SiC business models are still different, some trends are emerging – such as vertical integration in order to maximize revenues in the near future. This restructuring we are seeing of the supply chain is driven by the main cost factors.
Since the commercialization of the first SiC device in 2001, the performance and value that these devices add has steadily been proven. Device price has also become increasingly acceptable to end-users.
In 2019, SanRex started mass production of a 1200V SiC MOSFET module with the company’s unique TechnoBlock packaging technology. This product was commercialized in joint development with Panasonic Corporation and is equipped with Panasonic’s SiC-MOSFET ‘DioMOS’ (Diode-integrated MOSFET) technology, which integrates free-wheel diode function.
In this context, Yole SystemPlus provides a full reverse costing study of the SiC MOSFET module from SanRex: FCA150AC120.
This is a transfer-molded SiC power module of 1200V breakdown voltage and 150A continuous drain current.
Supported by a full teardown of the module, our report reveals SanRex’s technology choices for its assembled module as well as the design of the Panasonic SiC-MOSFET die inside.
This report also provides insights into the technology data, manufacturing cost, and selling price of the module, as well as an estimated manufacturing cost of all the module’s parts.
Included too is a physical and cost comparison of 1200V SiC power modules from SanRex and StarPower (MD300HFR120B3S).
