Technology, Process and Cost Comparison
SAW Filter Comparison 2025
In-depth tech & cost comparison of 21 SAW filters — SAW, TC-SAW, ML-SAW — from Murata, Qorvo, Qualcomm (RF360), Skyworks and 11 more.
SPR25911
Key Features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Technical Comparisons
- Cost Comparisons
What's New
- Biggest physical & cost comparison of the SAW filters.
- Complete analysis of the 10 filters by 8 major companies: Murata, Qorvo, Qualcomm and others.
- Comparison of the four additional filters from same manufactures and 7 from other manufacturers.
- TEM imagers of the POI ML-SAW filters.
According to the RF Front-End Market Forecast , filters represent the most dynamic segment and the second-largest part of the RF front-end market in terms of value. Filters are the dominant components among discrete devices. In this context, Yole Group sees this as an ideal opportunity to assess the various SAW technologies available from different players, considering their implementation, technological approaches, and costs.
Surface-acoustic-wave (SAW) filters are manufactured in three main process families: conventional SAW, thermo-compensated SAW (TC-SAW), and multilayer SAW (ML-SAW). Most devices use piezoelectric substrates such as lithium tantalate (LiTaO₃, LT) or lithium niobate (LiNbO₃, LN). Although single-crystal LT and LN wafers dominate, some designs bond a thin LT or LN layer to an insulating substrate (ML-SAW technology).
This report provides insights into SAW resonator technology data from different suppliers. We include a comparative study of ten components supplied by eight major companies — Murata, Qorvo, Qualcomm (RF360), Sanan IC, Shenzhen Microgate, Skyworks, TDK-EPCOS, and Wisol. The scope is then expanded to cover a comparison of four additional filters from these same manufacturers, along with seven more filters provided by ACT, ANUKI, Broadcom, Kyocera, Sawics, Tai-SAW, and Taiyo Yuden.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Company profiles
- Technology Landscape
- Market Forecast
- Wafer Suppliers
Physical Analysis
- Summary
- Qorvo
- Qualcomm (RF360)
- Sanan IC
- Shenzhen Microgate
- Skyworks
- TDK-EPCOS
- Murata
- Wisol
Physical Comparison
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