Technology, Process and Cost
Seek Thermal Infrared Camera & Raytheon IR Microbolometer
By Yole SystemPlus —
The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS.
Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market.
The Seek Thermal camera has a very compact size and is compatible with Android smartphones via its micro-USB connector. The camera performs its calibration automatically thanks to an electromechanical shutter assembled on the electronic board. The device also includes a chalcogenide lens inserted in a zinc lens housing.
The thermal camera uses a new 12µm pixel design from Raytheon. The EXC001 microbolometer, is featuring a 206×156 pixels resolution, 6 times the resolution of the FLIR One. The sensor technology in the Raytheon component is an uncooled VOx microbolometer and a 2 levels structure. Thanks to its strong integration at the die level with a wafer-level packaging (WLP), this is the world’s smallest microbolometer-based thermal imaging camera die.
Based on a complete teardown analysis of the Seek Thermal Camera and the Raytheon microbolometer, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
At last, a characteristics comparison between Flir One and Seek Thermal Cameras highlights differences in technical choices made by both companies.
COMPLETE TEARDOWN WITH:
- Camera teardown
- Flir One and Seek Thermal comparison
- Bill of Material
- Module Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
SEEK THERMAL Camera (62 pages)
Overview/Introduction, Main Features
Flir One and Seek Thermal comparison
Teardown
- Packaging
- Views and Dimensions of the Housing
- Seek Thermal Camera Disassembly
- Shutter Module
- Lens Module
- Electronic Board
High Definition Photos & PCB Markings
Components Markings & Identification
Cost Analysis
- Accessing the BOM
Estimation of the cost of the PCB
BOM Cost – Electronic Board, Housing and Packaging
Material Cost Breakdown - Accessing the Added Value (AV) Cost
Electronic Board Manufacturing Flow & AV Cost
Housing & Packaging Assembly AV Cost
Added Value Cost Breakdown - Estimation of the Manufacturing Price
EXC001 Infrared Camera Module (104 pages)
Overview/Introduction, Company Profiles, Main Features
Flir One and Seek Thermal comparison
Physical Analysis
- EXC001 Microbolometer
View & Dimensions
Disassembly & Cross-Section - Infrared Sensor
Microbolometer & ROIC Views & Dimensions
Pixel Details, Delayering
Cross-Section & Process Characteristics
Manufacturing Process Flow
- ROIC Process & Microbolometer Process Flow
- Wafer Fabrication Unit
Cost Analysis
- Yield Hypotheses
- ROIC & Microbolometer Wafer & Die Cost
- ASIC Wafer & Die Cost
- EXC001 die Cost & Price