Performance Analysis
SiC Modules Performance Analysis 2024 Vol 1
A performance battle between Semikron Danfoss eMPack® (SiC) and Infineon HybridPACK™ Drive (IGBT), showcasing 1200V automotive power module potential
SPR24814Key Features :
- Static Performance test Analysis and comparison of various metrics: on-state resistance, threshold voltage, breakdown voltage, leakage currents (gate-source, drain-source)…
- Performance test results for different temperatures: -55°C, -40°C, 25°C, 100°C, 150°C, 175°C.
- Main Physical Analysis linked to performance metrics. (Package opening, Die dimensions)
- Performance comparison versus technology (Figure Of Merits).
What's new:
- New type of product from Yole Group featuring performance test comparison of SiC MOSFET modules.
- This third-party objective comparison is realized under identical test conditions which is rarely the case if one tries to compare separately the performance based on datasheets.
The market for Power SiC devices is growing rapidly, with Yole Group forecasting it will exceed a staggering US$10 billion by the end of this decade. This growth is fueled by the rising demand for efficient power electronics in BEVs, renewable energy systems, and industrial automation. However, with this expansion comes the need for rigorous performance analysis to ensure that these devices meet the high standards required for their applications.
Understanding the critical role of performance benchmarking for SiC devices, Yole Group, powered by SERMA Technologies, has developed a comprehensive analysis framework for SiC MOSFETs. In this context, after launching their "SiC MOSFET Discretes Performance Analysis 2024 Vol. 1" as the first product in their new collection of performance reports focused on discretes, Yole Group, powered by SERMA Technologies, is pleased to unveil their "SiC Modules Performance Analysis Report”.In this volume, the first SiC module tested is the Semikron Danfoss eMPack® eMP780MD12SC2SV1DPDA6, a 1200V-class module for automotive applications. This power module is tested and compared with the performance of a reference IGBT module of the same voltage class: the Infineon HybridPACK™ Drive FS380R12A6T4B. This IGBT module will serve as the reference for all future volumes of the SiC Modules Performance collection of reports.
In a field where performance claims can vary widely depending on the test conditions, having a third-party evaluation that provides consistent and reliable data is crucial. Some module datasheets are not even available online (as is the case with the analyzed Semikron-Danfoss module), which underscores the added value of such performance tests. These evaluations ensure that decisions based on these reports are grounded in reality, leading to more reliable and efficient system designs. In fact, the modules in this report are evaluated and compared using the same bench and under identical test conditions. Their key parameters and characteristics are assessed to provide valuable insights for engineers, researchers, and industries seeking optimized power solutions.
This report delves into the static performance of the selected modules to gain a comprehensive understanding of their merits. The comparative analysis involves assessing key metrics such as on-state resistance, drain-to-source voltage, threshold voltage, breakdown voltage, leakage currents, and more under varying operating conditions. It includes data and graphs of the tested modules for: RDS(on)(VGS), RDS(on)(IDS), VDS, VGS(th), VBR(DSS), IDSS, IGSS, QG, IDS(VDS), ISD(VSD)… Performance tests are conducted for various test temperatures (-55°C, -40°C, 25°C, 100°C, 150°C, 175°C) and in accordance with JEDEC norms and standards such as JESD 24 and JEP 183. The test protocol is outlined in the report. This third-party objective analysis is conducted under identical test conditions, which is rarely the case when attempting to compare performance based on module datasheets.
Additionally, Yole Group presents a physical analysis summary for both modules. (More details about the physical analysis (teardown) of the Semikron Danfoss eMPack® SiC module, as well as its manufacturing process cost analysis, will be covered in our report: Automotive Power Modules Packaging Comparison 2024.) This includes optical top and cross-section images with measurements of the package and the die. The parameters derived from the physical analysis are compiled to facilitate a comprehensive evaluation of their impact on the performance of the modules.
Overview / Introduction
- Executive summary
- Physical & Performance Analysis Methodology
- Glossary
Technology & Market Overview
Devices Datasheet & Company Profile
- 1200V SiC Module: Semikron Danfoss eMPack® eMP780MD12SC2SV1DPDA6
- Reference 1200V Si IGBT Module: Infineon HybridPACK™ Drive FS380R12A6T4B
Physical Analysis
For each of the modules, a summary of:
- Package View, Opening & Cross-Section
- Die View & Measurements
Performance Analysis
- Test protocol & conditions
- Performance test results for different temperatures (-55°C, -40°C, 25°C, 100°C, 150°C, 175°C): Data & graphs of RDS(on)(VGS), RDS(on)(IDS), VDS, VGS(th), VBR(DSS), IDSS, IGSS, QG, IDS(VDS), ISD(VSD)
Comparison
- Performance of the switching cell:
- Figure of Merit « FoM » : FoM (Qg*RDS(on)) vs. RDS(on) & FoM (RDS(on)*Area) vs. RDS(on)
- FoM (Qg*RDS(on)) vs. FoM (RDS(on)*Area)
- Performance of the die & switching cell:
- Current density and FoM
- VGS(th) , VBR and Rdson evolution in terms of temperature
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About Yole Group
Infineon, Semikron Danfoss