Technology, Process and Cost Comparison
Smartphone Camera Module & CIS Comparison 2023 Vol.1 - iPhone Evolution
By Yole SystemPlus —
An eight-year evolution of ultra-premium iPhone cameras, from the 6S Plus (2015) to the 14 Pro Max (2022)
SPR23694
Overview / Methodology
- Executive Summary
- Reverse Costing Methodology
- Glossary
Companies & Supply Chain
- Apple
- Sony
- LG Innotek
- STMicroelectronics
- Players & Market Context
- Supply Chain
Physical Comparison & Evolution
- Camera Overviews
- Physical Comparison
- Overview of the Physical Analysis
- iPhone 14 Pro Max ; iPhone 13 Pro Max ; iPhone 12 Pro Max ; iPhone 11 Pro Max ; iPhone XS Max ; iPhone X ; iPhone 8 Plus ; iPhone 7 Plus ; Phone 6S Plus
Manufacturing Processes
- Camera Module Structure
- Module Structure
- IR-Cut Filter
- Sensor-shift OIS
- CMOS Image Sensor Structure
- Sony CMOS Image Sensor Manufacturing Processes
- Fabs
- Pixel & Logic Circuits
- Cu-Cu Hybrid Bonding
- Optical Layers
- STMicroelectronics CMOS Image Sensor Manufacturing Processes
- Fab
- Process
Cost Comparison & Breakdown
- CMOS Image Sensor Costs
- Overview
- Front CIS Front-End Costs
- Front CIS Die Costs
- Rear CIS Front-End Costs
- Rear CIS Die Costs
- Rear CIS Die Comparison
- Camera Module Costs
- Front Camera Module Costs
- Rear Camera Module Costs
- Rear Camera Modules Cost Breakdown & Comparison
- Camera Costs & Prices
Detailed Physical Analysis
- Front Cameras
- NIR (Face ID)
- iPhone 14 Pro Max ; iPhone 13 Pro Max ; iPhone 12 Pro Max ; iPhone 11 Pro Max ; iPhone XS Max ; iPhone X ; iPhone 8 Plus ; iPhone 7 Plus ; iPhone 6S Plus
- Rear Cameras
- iPhone 14 Pro Max ; iPhone 13 Pro Max ; iPhone 12 Pro Max ; iPhone 11 Pro Max ; iPhone XS Max ; iPhone X ; iPhone 8 Plus ; iPhone 7 Plus ; iPhone 6S Plus
Feedback
Related Products
About Yole Group
Key Features
- Company profile
- Automotive SoC market analysis
- Detailed photos
- Precise measurements
- Front-end structural analysis with SEM
- Physical comparison
- Manufacturing process flow
- Supply chain evaluation
- Supply chain comparison
- Manufacturing cost analysis
- Manufacturing cost comparison
What's new
- Top-down analysis of car models including ECU teardowns and chip analysis to understand the automotive ADAS SoC market and supply chain
- Detailed physical and cost analysis of seven popular SoCs
- Physical and cost comparison shows how advanced manufacturing is penetrating the automotive industry
Aptiv, Arcfox, Audi, BMW, Flextronics, GAC Motor, Geely, Hiphi, HiSilicon, Huawei, Hyundai, Jaguar, LG, Livox, Li Auto, Mercedes-Benz, Mobileye, Nata, NIO, NVIDIA, NXP, Quadric, Qualcomm, Renesas, Samsung, STMicroelectronics, Intel, TESLA, TOSHIBA, TSMC, Valeo, Veoneer, Volvo, XILINX, XPeng, Zeeker, Zhiji Auto and more
Continuing our series of camera module (CM) and CMOS image sensor (CIS) comparison reports, in this latest report we summarize the results of our detailed physical analyses and costing studies in comparing the cameras in the iPhone 6S Plus, 7 Plus, 8 Plus, X, XS Max, 11 Pro Max, 12 Pro Max, 13 Pro Max, and 14 Pro Max. We aim to offer insight into the physical and cost evolution of the CMs and CIS’ over the last eight years of iPhones, including the latest iPhone 14 Pro Max.
Our analysis covers both front and rear RGB CMs, as well as the front-facing near-infrared (NIR) CM in the Face ID system. This includes the complete structure, design, and teardown of each CM, as well as the dimensions, technology node, and manufacturing processes of the CIS. The rear-facing LiDAR module is not covered, and only the light detection parts of the Face ID system are included*.
The iPhone series has followed the market trend of incrementally increasing rear CM quantity, lens count, and CIS size. The iPhone 11 Pro Max introduced a triple rear camera, which the 12 Pro Max enhanced by adding an innovative sensor-shift OIS and 7P lens system. The iPhone 13 Pro Max kept this configuration but made several significant upgrades, such as an enormous 1.9-µm pixel size in the main CIS and the addition of autofocus and a 6th lens in the ultra-wide module. The 14 Pro Max drastically increased the CIS size in the main and ultra-wide modules: the main CIS is over 50% larger than in the 13 Pro Max and has 48 Mp, the highest resolution yet in the series. It uses a quad Bayer color filter pattern that allows it to operate in a 4-pixel binning mode with an effective resolution of 12 Mp and an impressive effective pixel size of 2.44 µm. Optical stabilization of the large CIS is achieved by a 2nd-generation sensor-shift OIS system with a dual OIS/AF driver configuration.
The iPhone X saw the front camera evolve from a single-module system into the dual-module ‘TrueDepth’ camera with Face ID biometric authentication. The iPhone 13 Pro Max introduced a new 2nd-generation Face ID solution that integrates the NIR CM and NIR illumination subsystems in a single module, and the iPhone 14 Pro Max retained this module. The 14 Pro Max also incorporated for the first time an autofocus voice coil motor in the front RGB module.
*These systems are covered in detail in other reports, such as SP20557 (LiDAR), SP17379 (1st-gen dot projector), SP18383 (1st-gen flood illuminator), SPR21576 (1.5th-gen flood illuminator), and SPR21642 (2nd-gen Face ID system in the iPhone 13).
