Technology, Process and Cost
STMicroelectronics HTS221 Humidity and Temperature Sensor
By Yole SystemPlus —
High performances humidity sensor based on STMicroelectronics capacitive digital sensor in a tiny compact package
The HTS221 humidity sensor is the first environmental sensor from STMicroelectronics which follows the trend of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40…+125°C, 0…100 % relative humidity for 16bit output data for temperature and humidity.
The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.
This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.
The report presents a deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.
Overview / Introduction
Companies Profile
Physical Analysis
- Physical Analysis Methodology
- Package
Package Views & Dimensions
Package Opening
Wire bonding Process
Package Cross-Section - ASIC Die
View, Dimensions & Marking
ASIC Delayering
ASIC main blocks identification
ASIC Process
ASIC Die Cross-Section
- Pressure & Humidity Die
View, Dimensions & Marking
MEMS Humidity Sensing Area
Cap
MEMS Humidity Cross-Section
MEMS processes
Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor
Manufacturing Process Flow
- ASIC Front-End Process
- MEMS humidity Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit
Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Front-End Cost
- MEMS Humidity Wafer & Die Cost
- MEMS Humidity Front-End Cost
- MEMS Humidity Back-End 0 : Probe Test & Dicing
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- BME280 Component Cost
Price Estimation
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison of HTS221 vs. Bosch BME280 and Sensirion SHTC1