Technology, Process and Cost
STMicroelectronics’ VL53L5 dToF Laser Autofocus
By Yole SystemPlus —
STMicroelectronics’ 4th-generation ‘FlightSense’ multi-zone direct-time-of-flight depth ranger with SPAD ASIC, VCSEL, and wafer-level optic technology.
Flightsens: trademark of STMicroelectronics
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- dToF Depth Ranging
- VL53L5 Overview & Specs
- Glossary
Company Profile
Physical Analysis
- Summary of the Physical Analysis
- VL53L5 Module
- Module View & Teardown
- Module Cross Section
- SPAD ASIC Die
- SPAD ASIC Die Views & Dimensions
- SPAD ASIC Die Delayering
- SPAD ASIC Die Cross Section
- SPAD ASIC Die Process Summary
- VCSEL Die
- VCSEL Die View & Dimensions
- VCSEL Die Cross Section
- VCSEL Die Process Summary
- Physical Comparison (w/ ams TMF8821)
- Overview
- VCSEL
- Emission Optics
- Reception Optics
- SPAD ASIC
- Manufacturing Process Flow
- SPAD ASIC Die Fabrication Unit
- SPAD ASIC Die Front-End and Back-End Processes
- VCSEL Die Fabrication Unit
- VCSEL Die Front-End & Back-End Processes
- Package Fabrication Units
- Package Manufacturing Processes
- Final Test & Dicing
Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- SPAD ASIC Die
- SPAD ASIC Die Circuit Front-End Costs
- SPAD ASIC Die Optical & Gold Layers Costs
- SPAD ASIC Die Total Front-End Costs
- SPAD ASIC Die Probe Test, Thinning & Dicing
- SPAD ASIC Die Cost
- VCSEL Die
- VCSEL Die Front-End Costs
- VCSEL Die Front-End Step Costs
- VCSEL Die Probe Test, Thinning & Dicing
- VCSEL Die Cost
- Wafer-Level Optic Diffuser Die
- Wafer-Level Optic Fresnel Lens Die
- Package Manufacturing
- Completed Module Cost and Breakdown
Cost Comparison (w/ ams TMF8821)
Selling Price
Feedback
Related Products
About Yole Group
Smartphone photography depends on autofocusing to produce images that are clear and sharp. There are several techniques to achieve autofocus, and modern smartphones typically rely on a combination of them in order to quickly, accurately, and reliably optimize the focal planes of their photography camera modules.
Premium smartphones include direct-time-of-flight (dToF) depth ranging, often marketed as “laser autofocus.” Because it relies on near-infrared VCSEL emission, dToF depth ranging works in both bright and low light conditions. Solutions range from simple 1D modules like that found in the LG G3 (2014) to sophisticated, costly 3D imaging solutions like the 0.03-megapixel LiDAR module used in the iPhone 12 Pro (2021). Somewhere in between are multi-point depth rangers which use the same SPAD, VCSEL, and optics technology as LiDAR, but in a smaller, less expensive package with far fewer pixels. These components perform low-resolution depth mapping that, while arguably not 3D imaging per se, is ample for the needs of smartphone photography autofocusing.
Leading Android OEMs like Samsung, Huawei, and Xiaomi rely on STMicroelectronics’ FlightSenseTM dToF modules for their flagship cameras, making the European company the clear market leader in consumer multi-zone depth ranging. In fact, we estimate that this line of products accounts for revenue on the order of $500M USD, roughly half of the company’s imaging business.
This full reverse costing study provides insights into the technology data, manufacturing cost, and selling price of STMicroelectronics’ VL53L5, the company’s 4th-generation FlightSenseTM multi-zone dToF depth ranging module used in the Samsung Galaxy S22 Ultra and Xiaomi 12S Ultra, among others. A detailed physical analysis, including a teardown, cross-sectional analysis, circuit delayering, and scanning electron microscopy, is used to determine the component structures and estimate the manufacturing processes used to make the VCSEL die, SPAD ASIC die, and diffractive optical elements, as well as to assemble the module. This information is then used to calculate the costs of production.
We also include a physical and cost comparison with the TMF8821 by ams – a lower-cost alternative with similar specs, found in the Honor Magic3 Pro.
- ams
- Samsung
- Xiaomi
- STMicroelectronics
- Trumpf
- IQE
- Viavi (specifically the subsidiary RPC Photonics)
Key Features:
- Detailed photos
- Detailed SEM images
- Teardown
- Cross-sectional analysis
- Delayering analysis
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Physical & cost comparison with ams’ TMF8821