Technology, Process and Cost

STMicroelectronics’ VL53L5 dToF Laser Autofocus

By Yole SystemPlus — Aug 2022

STMicroelectronics’ 4^th-generation ‘FlightSense’ multi-zone direct-time-of-flight depth ranger with SPAD ASIC, VCSEL, and wafer-level optic technology.

Flightsens: trademark of STMicroelectronics

Smartphone photography depends on autofocusing to produce images that are clear and sharp. There are several techniques to achieve autofocus, and modern smartphones typically rely on a combination of them in order to quickly, accurately, and reliably optimize the focal planes of their photography camera modules.

Premium smartphones include direct-time-of-flight (dToF) depth ranging, often marketed as “laser autofocus.” Because it relies on near-infrared VCSEL emission, dToF depth ranging works in both bright and low light conditions. Solutions range from simple 1D modules like that found in the LG G3 (2014) to sophisticated, costly 3D imaging solutions like the 0.03-megapixel LiDAR module used in the iPhone 12 Pro (2021). Somewhere in between are multi-point depth rangers which use the same SPAD, VCSEL, and optics technology as LiDAR, but in a smaller, less expensive package with far fewer pixels. These components perform low-resolution depth mapping that, while arguably not 3D imaging per se, is ample for the needs of smartphone photography autofocusing.

Leading Android OEMs like Samsung, Huawei, and Xiaomi rely on STMicroelectronics’ FlightSense^TM dToF modules for their flagship cameras, making the European company the clear market leader in consumer multi-zone depth ranging. In fact, we estimate that this line of products accounts for revenue on the order of $500M USD, roughly half of the company’s imaging business.

This full reverse costing study provides insights into the technology data, manufacturing cost, and selling price of STMicroelectronics’ VL53L5, the company’s 4^th-generation FlightSense^TM multi-zone dToF depth ranging module used in the Samsung Galaxy S22 Ultra and Xiaomi 12S Ultra, among others. A detailed physical analysis, including a teardown, cross-sectional analysis, circuit delayering, and scanning electron microscopy, is used to determine the component structures and estimate the manufacturing processes used to make the VCSEL die, SPAD ASIC die, and diffractive optical elements, as well as to assemble the module. This information is then used to calculate the costs of production.

We also include a physical and cost comparison with the TMF8821 by ams – a lower-cost alternative with similar specs, found in the Honor Magic3 Pro.

Key Features:

Detailed photos
Detailed SEM images
Teardown
Cross-sectional analysis
Delayering analysis
Precise measurements
Materials analysis
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated selling price
Physical & cost comparison with ams’ TMF8821

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STMicroelectronics’ VL53L5 dToF Laser Autofocus

STMicroelectronics’ 4th-generation ‘FlightSense’ multi-zone direct-time-of-flight depth ranger with SPAD ASIC, VCSEL, and wafer-level optic technology.

Key Features:

STMicroelectronics’ 4^th-generation ‘FlightSense’ multi-zone direct-time-of-flight depth ranger with SPAD ASIC, VCSEL, and wafer-level optic technology.