Technology, Process and Cost
TDK IIM-20670 6-axis IMU
By Yole SystemPlus —
TDK-Invensense IIM-20670 IMU is the latest TDK’s 6-axis IMU with a current consumption below 10 mA under all operating conditions. .
YSPR23766
Key Features
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
Product's objectives
- Technology data, manufacturing cost and selling price of the TDK-Invensense IIM-20670 Inertial Measurement Unit (IMU )
- TDK-Invensense IIM-20670 IMU is part of a family of a 6-axis MEMS IMU supplementing the Smart-industrial product line.
This full reverse costing study provides insight into technology data, manufacturing cost and selling price of the TDK-Invensense IIM-20670 Inertial Measurement Unit (IMU) which features a robust monolithic 6-axis IMU, three-axis angular rate sensor and three-axis acceleration sensor.
The TDK-Invensense IIM-20670 IMU is part of a family of a 6-axis MEMS IMU supplementing the Smart-industrial product line.
This new 6-axis IMU targets industrial applications that require great vibration immunity and extreme stability over temperature. The device operates at a range from -40ᵒC to 105ᵒC.
TDK-Invensense claims that this device is capable to simultaneously measure all the six axes with a current consumption below 10 mA under all operating conditions.
The TDK-Invensense IIM-20670 consists of:
- The ASIC/MEMS die designed by TDK-Invensense and manufactured by TSMC in Taiwan.
- QFN 24-pin package.
- TSMC
- TDK Invensense
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Financial Statements – TDK-Invensese
- TDK-Invensense Supply Chain
- Product Specifications TDK-Invensense IIM-20670
Physical Analysis
- Synthesis of the Physical Analysis
- Summary of the physical analysis
- Package
- Package View & Dimensions
- Package Opening
- Package Cross-Section
- Die
- View, Dimensions & Marking
- MEMS Removed
- MEMS Sensing Area
- MEMS 3-axis Gyroscope
- MEMS 3-axis Accelerometer
- MEMS Cap
- Die Cross-Section: MEMS (Pads Opening)
- Die Cross-Section: MEMS (Sealing)
- Die Cross-Section: Sensor (Electrical Contacts)
- Die Cross-Section: Sensor (Standoffs)
- Die Cross-Section: Sensor (Mobile Elements)
- Die Cross-Section: Cap
- ASIC Delayering & Process
- Die Cross-Section: ASIC
Manufacturing Process Flow Analysis
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
Cost Analysis
- Synthesis of the cost analysis
- TDK-Invensense Supply Chain
- Yields Explanation & Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- ASIC/MEMS Assembly Cost
- Total Front-End Cost
- Back-End : Probe Test & Dicing
- Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
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