Technology, Process and Cost
Texas Instrument Gate Driver UCC5880
Texas Instruments UCC5880 gate driver: full teardown, packaging analysis and manufacturing cost estimation
SPR25939Key Features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
Product's objectives
- Perform a comprehensive analysis using optical and scanning electron microscopy (SEM) cross-sections to reveal chip integration and placement, and to identify the packaging technology used.
- Provide insights into the back-end construction analysis.
- Include X-ray imaging to visualize the dies layout within the package.
- Perform a cost analysis to determine the total component cost.
Inside Texas Instruments’s UCC5880 Gate Driver
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Texas Instruments UCC5880.
The Texas Instruments UCC5880 device is an isolated, highly configurable adjustable drive strength gate driver targeted to drive high power SiC MOSFETs and IGBTs in EV/HEV applications. Power transistor protections are included, such as shunt resistor based over-current, over-temperature (PTC, NTC, or diode), and DESAT detection, with selectable soft turn-off or two-level soft turn-off during these faults.
An integrated 10-bit ADC enables monitoring of up to 2 analog inputs, VCC2, DESAT, and the gate driver temperature for enhanced system management. Diagnostics and detection functions are integrated to simplify the design of ASIL compliant systems. The parameters and thresholds for these features are configurable using the SPI, which allows the device to be used with nearly any SiC MOSFET or IGBT.
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Packaging
- View & Dimensions
- X-Ray
- Opening
- Cross-Section
- IC Die 1 (Power section - High voltage)
- IC Die 2 (Integrated isolator)
- IC Die 3 (Control section - Low voltage)
Manufacturing Process Flow Analysis
- Global View
- Die Front-End Process
- Die Front-End Wafer Fabrication Unit
- Back-end 0
- Assembly & Final Test
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- IC Front-End Wafer Cost
- IC Back-End 0
- IC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
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