Technology, Process and Cost
Texas Instruments TCAN5102-Q
Detailed insights into the technology choices, system architecture, and economic positioning of the Texas Instruments TCAN5102-Q1.
SPR26994SCOPE
Analyzed devices: TCAN5102-Q
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
- Die delayering
- Material identification
Technology: BCD node
Type of Analysis
- SEM View
- TEM View
- Floorplan
- Cross section
- Delayering
- Optical View
- X-ray View
MANUFACTURING PROCESS FLOW
- Module​
- Component​
- Process​
- Wafer​
- Material​
- IP
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
Report's Objectives
- Present main technological trends and ongoing developments for this type of charger power electronics at each level (charging station, charger topology, charger system design, power device, semiconductor technology).
- Provide market metrics and forecasts for DC EV charger-related power electronic devices, from system down to wafer.
This reverse-costing study details the technology, architecture and cost structure of the Texas Instruments TCAN5102-Q1, an automotive-qualified CAN FD Light responder controller.
Standardized in ISO 11898-1:2024, CAN FD Light uses a commander-responder scheme that removes the microcontroller from the responder node, all control arriving over the CAN bus. Paired with a commander such as the TCAN4572-Q1, the device reaches 5 Mbps.
It integrates SPI, UART and I2C controllers plus 13 multiplexable GPIOs, driving sensors, actuators, lighting modules and motor drivers directly. Programmable PWM outputs with hardware trapezoidal ramp profiles suit stepper and actuator control in body electronics, lighting and electrified powertrain.
Running from a single 3 V to 5.5 V supply with no external crystal, and paired with TI's external CAN FD transceivers, this 20-pin HVSSOP device targets distributed CAN FD Light nodes, in line with the trend toward fewer ECUs and network-centric control.
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Summary
- Packaging Assembly
- IC Die
Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Wafer Back-end 0 Cost
- IC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
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