Technology, Process and Cost
Texas instrument - LM70880QRRXRQ1
Detailed physical data, high-voltage synchronous buck-converter architecture and process-flow analysis, and cost-structure assessment of Texas Instruments’ LM70880.​
SPR26991SCOPE
Analyzed devices : Texas Instruments LM70880
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
- Material identification
Technology:
- 180 nm BCD
- High-Voltage DC-DC Step-Down Converter
Type of Analysis:
- SEM View
- Cross section
- Delayering
- Optical View
- X-ray View
- EDX
MANUFACTURING PROCESS FLOW
Recreation of manufacturing process flow
Technical analysis:
- Component​
- Process​
- Wafer​
- Material​
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis:
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
In recent years, high-voltage synchronous buck converters have become key components in industrial, automotive, and power-management systems, offering efficient voltage conversion, compact designs, and reduced power losses.​
This report presents a detailed physical, technical, manufacturing, supply-chain, and costing analysis of Texas Instruments’ LM70880, an 80 V synchronous step-down converter with integrated power MOSFETs.​
We provide a complete analysis of the component’s architecture, semiconductor process, package assembly, manufacturing flow, and estimated production cost.​
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PRODUCT'S OBJECTIVES
- Describe the physical structure of the Texas Instruments LM70880, including its package, die, dimensions, materials, and assembly.
- Identify its functional architecture and main synchronous buck-converter building blocks.
- Estimate the component’s manufacturing cost, including wafer fabrication, die cost, packaging, assembly, and testing.
Texas Instruments LM70880 – 80 V Synchronous Buck Converter with Integrated MOSFETs: Physical, Manufacturing and Cost Analysis
In recent years, high-voltage synchronous buck converters have become key components in industrial, automotive, and power-management systems, offering efficient voltage conversion, compact designs, and reduced power losses.
This report presents a detailed physical, technical, manufacturing, supply-chain, and costing analysis of Texas Instruments’ LM70880, an 80 V synchronous step-down converter with integrated power MOSFETs.
We provide a complete analysis of the component’s architecture, semiconductor process, package assembly, manufacturing flow, and estimated production cost.
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
Physical Analysis
- Package View & Dimensions
- Package Opening - Cross-Section
- MOSFET Die 1 View & Dimensions
- MOSFET Die 1 Delayering – Cross-section
- MOSFET Die 2 View & Dimensions
- MOSFET Die 2 Delayering – Cross-section
- IC Die 3 View & Dimensions
- IC Die 3 Delayering – Cross-section
Manufacturing Process Flow Analysis
- Overview
- IC Die 3 Front-End Process
- IC Die 3 Front-End Wafer Fabrication Unit
- IC Die 3 Back-end 0
- MOSFET Die 1 & 2 Front-End Process
- MOSFET Die 1 & 2 Front-End Wafer Fabrication Unit
- MOSFET Die 1 & 2 Back-end 0
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- IC Die 3 Front-End Wafer Cost
- IC Die 3 Cost
- MOSFET Die 1 & 2 Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
Feedbacks
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