Technology, Process and Cost Comparison

TMR based Current Sensors Comparison 2026

Feb 2026

TMR Current Sensors from Allegro Microsystems, NVE Corporation, and Sinomags: Technology, Process Flow, Supply Chain, and Cost Comparison

SPR26997

SCOPE

Analyzed end-system

BYD 12-in-1 800V e-platform 3.0 Evo for BYD Sea Lion 07EV

Analyzed devices

Sinomags: STK-616T-65MFB5
Allegro Microsystems: ACS37100LMATR-050B3 ; CT456-H00B3-TS08
NVE Corporation: ACT001-10e, ALT025-14E

PHYSICAL ANALYSIS

Detailed photos in optical and SEM views
Precise thickness measurements
Package opening
ASIC delayering
Material identification
Lamella preparation for magnetic tunnel junction observation

MANUFACTURING PROCESS FLOW

Recreation of manufacturing process flow
Step by step process flow

COST ANALYSIS

Supply chain evaluation
Simulation of device cost

Objectives

Give a general physical analysis of 5 TMR-based current sensors dedicated to such application like sensors target a broad range of applications, including on-board chargers, DC-DC converters, server power, C&I solar string inverters, and DC EV charging.
Present an overview of the approximate manufacturing process flow for the analyzed TMR-based current sensors.
Provide a physical and manufacturing cost comparison among these analyzed TMR-based current sensors.

The magnetic sensor market reached total revenue of $3.2 billion in 2025 according to Yole’s Group Magnetic Sensors 2026. The revenues are driven primarily by automotive and industrial markets accounting for $1.9 billion and $0.7 billion, respectrfully.

Amid growing interest in TMR-based sensing technologies, Yole Group has published a comprehensive comparative study covering the technologies, supply chains, and costs of five TMR-based current sensors. The devices were selected based on their current sensing application using TMR-based technology. The analyzed devices include both integrated and contactless sensing approaches with technologies supplied by Allegro Microsystems, formerly Crocus Technology, NVE Corporation, and Sinomags. These sensors target a broad range of applications, including on-board chargers, DC-DC converters, server power, C&I solar string inverters, and DC EV charging etc. The report assesses products from established global players in North America and Europe, as well as a Chinese supplier like Sinomags.

By examining each current sensor’s design, manufacturing process, and cost structure, the report provides detailed insights into package types, ASIC and TMR-based magnetometer die features, and observations derived from optical and SEM imaging. Cross-sectional analyses of packages, ASICs, diodes, and magnetometer dies offer a comprehensive view of device structures and dimensions. In addition, the report includes lamella analysis of a thin region containing magnetic tunnel junction (MTJ) structures. Scanning transmission electron microscopy (STEM) analysis of the lamella provides significantly improved layer resolution compared with a standard cross-section, enabling nanometer-scale visualization of the MTJ stack and supporting material identification through EDX.

The findings highlight key differences among manufacturers in substrate selection and sensor fabrication methods. The study also compares structural and technological strategies, including package dimensions, sensor size and architecture, ASIC technology nodes, and detailed cost breakdowns covering sensor and ASIC dies, testing, and packaging.