Technology, Process and Cost
SMART TPMS Comparison 2026
Inside the SMART TPMS: packaging, MEMS integration, and cost structures of seven sensors from Infineon, Bosch, Senasic, Sensata, Melexis, and STMicroelectronics.
SPR26061SCOPE
Analyzed devices
- Infineon SP49T & SP40
- Bosch SMP290
- Senasic SNP739
- Sensata SM1027
- Melexis MLX91804
- STMicroelectronics NTM88
From end-systems
- Continental Gen II Tire sensor
- Cerebrum ECO Smart Tire Sensor
- Schrader TPMS 29501-4 AirCheck BLE
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- End-system opening
- Package opening
- Material identification
Technology
- MEMS:
- Pressure sensor (Piezoresisitve & Capacitive)
- Accelerometer
- MCU with RF & Bluetooth (no full analysis of communication tech)
Type of Analysis
- Optical View
- X-ray View
- SEM View
- Cross-section
- Delayering
- Doping revelation
MANUFACTURING PROCESS FLOW
- Recreation of manufacturing process flow
- Step by step process flow
Technical analysis
- End-system
- Component​
- Process​
- Wafer
- Material​
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
What's new
The last edition of the report was release in 2021.
- The report demonstrates a technological shift of standard TPMS towards SMART TPMS devices.
- The report includes an analysis of seven recent SMART TPMS devices supplied by various geographically diverse players, whereas the 2021 edition covered mostly standard TPMS devices.
- The report also presents the integration of some of these smart TPMS devices into end-systems.
- The strategies used to achieve Bluetooth communication between the end-system and the TPMS chip are demonstrated.
- Give a general physical analysis of 7 smart TPMS devices based on MEMS technology used for automotive application.
- Present an overview of the approximate manufacturing process flow for the analyzed smart TPMS devices.
- Provide a physical and manufacturing cost comparison among the analyzed smart TPMS devices.
The TPMS market reached $2.4B in 2025 (+4.9% YoY) and keeps growing, per Yole Group's Status of the MEMS Industry 2026. Growth is driven by replacement of first-installed modules, limited by battery life, and by legislation: UN ECE R141, fully implemented in the EU for all new vehicles, FMVSS No. 138 in the USA, GB 26149-2017 in China, and KMVSS in South Korea.
Latest-generation TPMS go beyond pressure monitoring, adding tire speed and position, blow-out detection, mileage and battery estimation, and Bluetooth low energy communication approach.
Yole Group's comparative study covers the technology, supply chain, and cost of seven Smart TPMS devices: Infineon SP49T & SP40, Bosch SMP209, Senasic SNP739, Sensata SM1027, Melexis MLX91804, and STMicroelectronics NTM88, integrated in end-systems from Continental, Cerebrum, Schrader, BHSENS, and Jinyunsheng.
From optical and SEM cross-sections, it compares substrates, packaging, MEMS die integration, size and architecture, fabrication, and costs for dies, probe test, and dicing.
Overview
Company Profile, Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Comparison
Related Reports
Cerebrum Sensor Technologies, Continental AG, Schrader TPMS Solutions, Sensata Technologies, Infineon technologies, STMicroelectronics, NXP Semiconductors, Ningbo SENASIC Electronics Technology Co., Ltd, Huizhou Jinyunsheng Technology Co., Ltd, Melexis Technologies NV, Robert Bosch, X-fab, onsemi (ON Semiconductor Corporation), TE Connectivity, SMI Pressure Sensors (Silicon Microstructures, Inc.), Silicon labs, BHSENS.