Technology, Process and Cost

UNT 1200V SiC Power Module

Feb 2026

Yole Group reveals for the first time in the industry the key deep-dive analysis of the UNT 1200V SiC power module with proprietary 8-inch SiC dies

SPR26981

Key features:

Physical Analysis of the module packaging in detail (opening, optical and SEM cross-section, material EDX analysis)
Physical Analysis of the UNT SiC MOSFET (delayering, optical and SEM cross-section, material EDX analysis)
Detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
Cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module cost breakdown, and price estimation

Product objectives:

Provide a comprehensive reverse costing study of the UNT 1200V SiC power module.
Provide exhaustive physical and technology analysis (Optical and scanning electron microscope (SEM) images with EDX material analysis) from the module’s opened package, down to the microscopic level of MOSFET design.
Analyze UNT packaging innovations for this platform. This includes UNT’s innovative technology choices for attaching its SiC dies on the ceramic substrate and how they are interconnected between one another.
Provide for the first time a detailed analysis of the design of the UNT proprietary SiC MOSFET chip produced on 8inch SiC wafers.
Provide detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
Provide an exhaustive cost analysis based on SiC 8-inch cost model: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module on cooler cost breakdown, and price estimation with a detailed Yield model for each process cost sequence (Wafer, die, packaging)

Tightening environmental regulations aimed at reducing average CO₂ emissions are accelerating the global shift toward vehicle electrification. This regulatory pressure is driving increased adoption of Electric and Hybrid Electric Vehicles (xEVs). In response to these trends, Yole Group forecasts that the xEV market will reach 64.3 million vehicles by 2030, with Battery Electric Vehicles (BEVs) accounting for 27.9 million.

For the first time in the industry, Yole Group analyzes the United Nova Technology (UNT) SiC automotive power module. UNT was founded in 2018 and was listed on the Sci-Tech Innovation Board (STAR Market) in 2023. UNT is a leading domestic foundry with automotive-grade power chip and module manufacturing capabilities. The analyzed power module features UNT’s proprietary SiC MOSFET chips with innovative interconnect and die assembly technologies for module packaging.

Yole Group delivers a comprehensive reverse costing study of UNT’s direct-cooled SiC module, detailing its internal architecture and packaging innovations.

Supported by a complete analysis of the design of UNT’s SiC MOSFET dies, as well as a full teardown of the module packaging (opening/deprocessing and cross-sections, optical and SEM images with EDX analyses for both the package and the SiC MOSFET dies), Yole Group’s report reveals UNT’s innovative technology choices for assembling its SiC dies.

This report includes insights into the module’s technology, simulated manufacturing costs for all module components, and an estimated selling price for the final power module. It also features a full teardown of the UNT module, highlighting design and material choices, along with detailed manufacturing process steps and a cost breakdown of all module components.

This report provides valuable intelligence for stakeholders across the EV supply chain, from OEMs and Tier-1 suppliers to packaging solution providers and power module manufacturers, as they navigate the evolving market and technological landscape.