Technology, Process and Cost
Vitesco Technologies Power Module in Jaguar I-PACE Inverter
By Yole SystemPlus —
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
The new environmental regulations to reduce average CO2 emissions and automotive trends play in favor of greater vehicle electrification and faster deployment of Electric Vehicles/Hybrid Electric Vehicles (EV/HEVs). Yole Développement expects that the EV/HEV market will reach 41 million vehicles by 2026.
Innovations in power module design are continuously being developed for enhanced performance. We can find them in all power module structures, from the baseplate and substrate assembly down to the die attach, through the electrical connection.
In this context, System Plus Consulting provides a full reverse costing study of the Vitesco Technologies IGBT Power Module integrated in Jaguar’s I-PACE Inverter.
First of all, the module uses an innovative chip assembly process with double side sintering. Moreover, to enhance electrical performance, clip connections and substrates are optimized for silver sintering. In addition, the baseplate is designed specifically for strict automotive performance requirements.
Supported by a full teardown of the module, this report reveals Vitesco Technologies’ choices in packaging as well as the designs of its IGBT and diode chips.
This report provides insights into technology data, manufacturing cost and selling price of the module. It includes an estimated manufacturing cost of all the module’s components anda selling price analysis.
The report also includes a comparison between the analyzed Vitesco Technologies power module with the Infineon HybridPACK™ Drive FS820R08A6P2B. These comparisons highlight differences in the packaging design and costs.
Overview/Introduction
- Executive Summary
- Market
- Reverse Costing Methodology
- Glossary
Company Profile
- Vitesco Technologies Company Profile
- Vitesco Technologies Product Catalog
Physical Analysis
- Synthesis of the Physical Analysis
- Package Analysis
- Package Opening
- Package Cross-section
- Si IGBT Die
- IGBT Die View and Dimensions
- IGBT Die Process
- IGBT Die Cross-section
- Si Diode Die
- Diode Die View and Dimensions
- Diode Die Process
- Diode Die Cross-section
Physical Comparison
- Vitesco Technologies vs Infineon Power Modules
Manufacturing Process
- Si IGBT Fabrication Unit
- Si IGBT Process Flow
- Si Diode Fabrication Unit
- Si Diode Process Flow
- Final Test and Packaging Fabrication Unit
- Packaging Process Flow
Cost Analysis
- Summary of the Cost Analysis
- Yield Explanations and Hypotheses
- Si IGBT
- IGBT Front-End Cost
- IGBT Wafer Cost per Process Step
- IGBT Die Probe Test and Dicing
- IGBT Die Cost
- Si Diode
- Diode Front-End Cost
- Diode Wafer Cost per Process Step
- Diode Die Probe Test and Dicing
- Diode Die Cost
- AMB Cost
- AMB BOM Cost and Assembly Cost
- Module Cost
- Packaging BOM and Assembly Cost
- Module Final Cost
Cost Comparison
- Vitesco Technologies vs Infineon Power Modules
Selling Price Analysis
- Estimation of selling price
Feedback
Related Analyses
Company Services
Complete teardown with:
- Detailed optical and SEM photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology and cost comparisons with Infineon’s HybridPACK™ Drive FS820R08A6P2B
