Technology, Process and Cost
xMEMS Microspeaker integrated in Singularity ONI
Technology and cost analysis of the xMEMS Montara microspeaker that is integrated in the Singularity ONI earbuds.
SPR24786Key features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
Product objectives
- Provide a physical and manufacturing cost analysis of the first true MEMS full-range Microspeaker from xMEMS.
xMEMS Montara microspeaker
The MEMS microspeakers market is poised to grow in the coming years, reaching almost $100M by 2029. Although the adoption speed has slowed in recent years (because of the consumer downturn), the potential is still here, and microspeaker SMEs keep getting new design wins in TWS earbuds (as shown here with the Singularity ONI) and audio glasses. As the number of companies working on this technology keeps increasing, the market looks promising.
This full reverse costing study has been conducted to provide insight into the technology data, manufacturing cost, and selling price of the xMEMS Montara, a true silicon MEMS microspeaker solution.
The Singularity Industries ONI earbuds teardown shows us that it integrates 4 xMEMS Montara microspeakers, 2 per earbud.
This MEMS microspeaker is integrated into an LGA (Land Grid Array) with a metal cap package like the one used for microphone components. There is an acoustic port in the metal cap of the package available in 2 different models, with the acoustic port on the top face or on the side face, which is the one we have. The dimensions of the package are 8.36 mm x 6.04 mm x 1.15 mm.
The microspeaker is designed by xMEMS and the manufacturing is subcontracted to TSMC in Taiwan, which integrates piezoelectric (PZT) technology. The actuators are manufactured on thin membranes etched by micromachining on SOI substrates. There are 6 cavities/membrane areas on the MEMS die.
This report includes technology and cost analysis of the xMEMS Montara microspeaker. These analyses provide the technical intelligence necessary to understand this technology.
Overview
- Executive Summary
- xMEMS Montara Specifications
- Reverse Costing Methodology
- Glossary
Company Profile & Supply Chain
- xMEMS
- TSMC
- Supply Chain
- Technology explanation
Physical Analysis
- Summary of the physical analysis
- Module Overview, X-Ray
- Module Disassembly
- Packaging
- View & Dimensions
- Opening
- Cross-Section
- Patent
- MEMS Die
- Die View & Dimensions
- Die Process
- Die Cross-Section
- MEMS Characteristics
Manufacturing Process Flow Analysis
- MEMS Die Front-End Process
- MEMS Die Front-End Wafer Fabrication Unit
- MEMS Process Flow
- Final Test & Assembly
Cost Analysis
- Cost Analysis Summary
- Yields Explanation & Hypotheses
- MEMS Die Front-End and Back-end 0 Wafer Cost
- MEMS Die Back-End Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
- xMEMS
- Singularity Industries
- TSMC