Technology, Process and Cost
Xpeng Turing Central ADAS SoC
Detailed physical data, data processing unit architecture analysis, and cost structure of Xpeng’s first-generation ADAS SoC.
SPR26055SCOPE
Analyzed devices
- XPENG Turing SoC
From module
- Jabil IVI Controller for XPeng G7
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
- ASIC delayering
- Material identification
Technology
- TSMC advanced node
- XPENG self-design SoC
Type of Analysis
- SEM View
- TEM View
- Floorplan
- Cross section
- Delayering
- Optical View
- X-ray View
MANUFACTURING PROCESS FLOW
- Recreation of manufacturing process flow
- Step by step process flow
Technical analysis
- Module​
- Component​
- Process​
- Wafer​
- Material​
- IP
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
Report's objectives
- Provide technology data, manufacturing cost and selling price.
- Teardown details Mainboard in XIAOMI 4-in-1 Domain Controller for Xiaomi YU7 module to reveal the components supporting the main processor on the module board
- Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope.
- Clear view on the technology and supply chain.
- SoC package size, die size, die delayering to reveal the manufacturing
- SoC floorplan to reveal the IP architecture.
- Automotive SoC manufacturing, its supply chain and cost structures.
Xpeng Turing Automotive ADAS SoC: Technology, Architecture, and Cost Analysis
Xpeng's Turing chip represents a major step in the company's transition toward in-house, high-performance computing for intelligent vehicles. As the first chip developed in-house by Xpeng, it marks a pivotal milestone for the emerging leading OEM in China. Volkswagen will also introduce vehicles integrating the Turing chip for the China market in 2026.
Manufactured on TSMC's 7nm node, the Turing chip is designed to address the growing demands of autonomous driving and AI-powered cockpit systems. The SoC combines advanced process technology with a heterogeneous architecture optimized for automotive use. The platform integrates CPU, GPU, and a dedicated neural processing unit (NPU), enabling efficient execution of key workloads such as perception, sensor fusion, and real-time decision-making. Its architecture is tailored for multi-sensor environments, supporting high data throughput and low latency, while a unified memory approach enhances system efficiency.
The Turing chip delivers improved performance-per-watt, meeting strict automotive thermal and power constraints. High-speed memory integration further ensures reliability and sustained performance in demanding operating conditions.
By developing its own silicon, XPENG gains tighter control over hardware-software co-design, accelerating innovation and reducing reliance on external suppliers. Overall, the Turing chip reflects the broader industry shift toward custom automotive processors, enabling more capable, efficient, and scalable intelligent driving platforms.
- Overview
- Company Profile, Supply Chain, Market
- Physical Analysis
- Floorplan
- Manufacturing Process Flow
- Cost Analysis
- Selling Price Analysis
- Related Reports
- Yole Group corporate presentation
Xpeng, TSMC
