Technology, Process and Cost
Xreal - X1 Processor SoC
XREAL X1 proprietary SoC teardown and cost analysis, revealing its technology, die architecture, and supply chain
SPR26033SCOPE
Analyzed devices : XREAL X1 from XREAL One PRo
PHYSICAL ANALYSIS
- Detailed optical and SEM photos
- Precise measurements
- Die analysis
- Package analysis
Technology
- TSMC advanced node
- XREAL self-design SoC
- Memory node
Technical analysis
- Module
- Component
- Process
- Wafer
- Material
- IP
- Packaging
MANUFACTURING PROCESS FLOW
- Manufacturing cost analysis
- Step by step process analysis
Type of Analysis
- SEM View
- Floorplan
- Cross section
COST ANALYSIS
- Supply chain evaluation
- Simulation of production and selling cost
Type of Analysis
- Die cost
- Memory cost
- Yields
- Package assemble cost
Report's objectives
- Provide technology data, manufacturing cost and selling price
- Teardown Mainboard in Xreal One Pro to reveal the components supporting the main processor on the module board
- Physical analysis of packaging and processor die with X-ray, EDX, optical microscope and scanning electron scope
- Clear view on the technology and supply chain
- SoC package size, die size, die delayering to reveal the manufacturing
- SoC floorplan to reveal the IP architecture
- Automotive SoC manufacturing, its supply chain and cost structures
Reverse Costing and Technical Assessment of the XREAL X1 AR SoC
This reverse costing study has been conducted to provide insights into the technology, manufacturing cost, and market positioning of the XREAL X1 processor, a proprietary system-on-chip (SoC) designed to power XREAL’s next-generation augmented reality (AR) glasses.
Engineered specifically for spatial computing and mixed-reality applications, the X1 integrates a high-efficiency multi-core architecture optimized for real-time visual processing, sensor fusion, and low-latency rendering. Its heterogeneous compute platform combines dedicated AI acceleration, graphics processing, and video encoding/decoding engines, ensuring immersive user experiences with minimal power consumption.
Manufactured using an advanced 16 nm process node, the X1 balances computational throughput and energy efficiency, enabling sustained operation in compact wearable systems without active cooling. The SoC’s integrated ISP (Image Signal Processor) and SLAM (Simultaneous Localization and Mapping) modules enhance tracking accuracy, depth sensing, and environmental awareness—key requirements for next-generation AR interactions.
Featuring high-speed interfaces such as USB 3.2, DisplayPort 1.4, and PCIe, as well as wireless streaming and sensor synchronization buses, the X1 supports seamless data transfer between the AR headset and host devices. Its on-chip AI engine handles real-time gesture recognition, eye tracking, and spatial anchoring, reducing dependence on external compute resources.
With a focus on ultra-low latency, robust security, and thermal optimization, the XREAL X1 processor serves as the technological cornerstone of the company’s AR ecosystem. It integrates hardware-level encryption, a secure boot chain, and virtualization support for future XR applications. Together, these attributes make the X1 a scalable, energy-efficient platform tailored for AR
Overview/Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Physical Analysis
- Summary
- Packaging Assembly
- SoC Die
Manufacturing Process
- Global View
- Wafer Fabrication Unit
- Back-End 0
- Assembly & Final Test
- Summary
Cost Analysis
- Summary
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Wafer Back-end 0 Cost
- SoC Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
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