Technology, Process and Cost
YMTC 294L 3D NAND
Nationally supported and strategically positioned, YMTC is at the forefront of 3D NAND innovation, driving the advancement of China’s NAND memory industry.
SPR25941Key Features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Technical Comparisons
- Cost Comparisons
- New generation of YMTC’s 3D NAND. Interlayer connector architecture for wordline connection. No staircase. Smaller die size.
Product objectives
This Technology & Cost report analyzes YMTC’s 294-layer 3D NAND, found in the TiPro9000 SSD, to assess whether the company can continue to compete with the current leaders in the 3D NAND market.
- Exploring the technology behind the YMTC’s 294L 3D NAND in China
- ​Insight into the new 3D NAND technology firstly used by YMTC
- A comprehensive study of the physical structure and detailed process flow of the array part.
- A detailed perspective on the 3D NAND architecture, clearly highlighting the area allocation for storing data (array) and the periphery logic (CMOS area) bonded by hybrid bonding
YMTC challenges global NAND leaders with advanced 294-layer Xtacking 4.0 technology
In 2024, global NAND revenue reached $68 billion, up 76% year-over-year, driven by a rebound in demand for high-capacity storage and rising average selling prices (ASPs), which increased 57% YoY to $0.08 per GB. While HBM and DRAM saw the greatest benefit from AI-driven demand, NAND remained essential for both enterprise and client SSDs.
YMTC continued to challenge global NAND leaders with the introduction of its 294-layer 3D NAND, featuring Xtacking 4.0. This architecture employs hybrid bonding to separate the NAND array from the CMOS logic and introduces interlayer connectors that replace the traditional staircase structure. This design reduces die area by over 25% and increases density by 33% compared to YMTC’s previous generation.
With 232 active layers, YMTC’s latest generation remains competitive in both bit density and package efficiency. Despite ongoing U.S. trade restrictions, the company continues to demonstrate strong technological innovation and cost control. A detailed reverse engineering study confirms YMTC’s ability to scale NAND performance and density, reinforcing its position as a serious contender in the global NAND market.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- YMTC timeline
- NAND Evolution & YMTC Products
- Xtacking Technology
- Market Analysis
Physical Analysis
- Summary of the physical analysis
- Package Analysis (X-Ray Images, Cross section, Opening)
- Die Analysis (cross section, process)
Physical Analysis Comparison
- Package, Memory die, Die Cross section, Bonding & CMOS Technology
Manufacturing Process Flow Analysis
- Global Overview
- CMOS & Memory Die Front-End Process
- CMOS & Memory Die Front-End Wafer Fabrication Unit
- Packaging process
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- CMOS & NAND Array Front-End Wafer Cost
- Bonding Cost
- TSV & Top Metal Cost
- Bonded Wafers Cost
- Memory Die Cost
- Packaging Cost
- Component Cost
- Cost per GB/Gb
Selling Price
- Definitions of Price
- Manufacturer Financials
- Estimated Selling Price
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